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Our Capabilities, Flip-chip capabilities, Dealing with larger scale dies, COTS and custom solutions to meet the toughest expectations, Upholding the highest quality standards, System in package
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Design Services
Standard Cells Libraries, TCAM & CAM, SRAM & ROM, Custom PDK and PCELL, Register Files
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ASIC Turnkey Service, Libraries Development Service, VLSI Design Service , Layout & Backend Service, IP Cores , Consultancy
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IC and Board Level Reliability, Failure Analysis & Eng Samples Preparation, FIB Circuit Edits Down to 3nm Process and Wafer Surface , Analog Design, ASIC Design and Supply Chain
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