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Development and Process Engineering, High Standard of Technological Equipment, Wafer Back-End Services
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ASIC Design , Testing and Packaging, Qualification and Failure Analysis, Supply Chain Management, IoT Operations Outsourcing Solutions, RF and Mixed-Signal Test, Front-end Tape-out, Mask and Wafer Procurement, Back-end Manufacturing and Test, GLOBALFOUNDRIES Channel Partner
RFID analog front-end
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Advanced packaging Services, Semiconductor test services, Mechanical, electrical and thermal modeling, Analytical services, reliability and failure analysis
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ASIC Design, ASIC Production, ASIC Production Management, Replacement of Obsolete Components
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RTL Design, Verification, Analog Layout, Physical Design, System Engineering, Embedded Software/Firmware
Custom SerDes, ARM HSSTP PHY with Link Layer, PCIe PHY, XAUI PHY, CEI SR PHY, SATA PHY
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