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Substrate and Packaging Design, Advanced Packaging Assembly, Substrate Manufacturing, Packaging Services, Full Turn Key
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SoC Design, Supply Chain Management, ASIC Services, FPGA Design
Processor IP, Digital and Analog IP
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Physical Design, STA & Synthesis, Flow Development, RTL Design & Integration, DFT, Design Verification, Circuit and Layout Design, Turnkey Solutions / IP Services
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Chip Design and Development, Device Implementation, Turnkey solutions, Speciality funding
12 bit SAR ADC, Digital temperature sensor
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IC Design Services, Semiconductor IP & Chip products, Full cycle ASIC and SoC Turnkey Solution , ASIC characterization services, Partner Access
CoreVCO, CorePLL, CorePLL6G, CoreADC, CoreDCDC, Antenna switch, Antennas, CoreHW IPs
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