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Featured Vendors

Integra Technologies and its full-turnkey capabilities of die preparation, packaging, testing and characterization of Hi-Rel semiconductor components and related value-added services.

Struent Semiconductors is a Semiconductors startup based out of India, offering turnkey, Time & Material and custom business models for ASIC/SoC development, specializing in low-power and Lower Technology nodes.

Allegro DVT

France

Allegro DVT provides Digital Video Compression Solutions, offering Encoder, Decoder, Pixel Processing IPs and industry-standard Compliance Test Suites.

Sofics

Belgium

Sofics is an IP provider improving reliability of ICs through innovative designs. Sofics offers 3 products: TakeCharge®, PowerQubic® and CustomIO®.

SmartSoC Solutions, a global company providing turnkey solutions for ASIC/SOC and Chip to Product, Digital Design (RTL, Verification, DFT, PD, Emulation, Validation) and Analog Mixed signal IP design (Circuit design and Mask Design).

Experior

Malaysia

Experior is dedicated to semiconductor testing. We provide one stop services in test design, development, validation and high volume testing.

SEMICONDUCTORS BACK-END SERVICES: IC’s Testing, IC’s Packaging, IC’s qualification-Reliability, IC’s Supply Chain and PCB Design and Fabrication.

Device Engineering is a Tempe, AZ, USA-based design and manufacturing facility specializing in Analog and Mixed-Signal Integrated Circuits.

DXCorr designs memory compilers as well as standard cell libraries to meet the stringent requirements for SoC designs.

ChipGlobe

Germany

ChipGlobe offers ASIC/FPGA Design Services in Design Centers in Munich, Belgrade, Singapore: RTL2GDS, Functional Verification, Embedded Systems + Prototypes.

IC-Logic

Germany

IC-LOGIC is a Microchip design company with focus on analog, digital and mixed signal ASIC designs.

HCLTech

Global

HCLTech is a leading ASIC Design services company with more than 27 years of experience in providing semiconductor services with focus on full Turnkey ASIC design service.

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