The Google of the Semiconductor Industry

XQWave is a semiconductor consulting firm delivering end-to-end ASIC, embedded, and silicon solutions with deep industry expertise and proven execution.

DXCorr designs memory compilers as well as standard cell libraries to meet the stringent requirements for SoC designs.

EKSS Microelectronics was established in 2002 and provides Complex IC Product and Test Engineering, Assembly,Supply Chain Services & Consultancy to the Fabless Semiconductor & IC Design House community.

FortifyIQ develops HW security IP cores fortified against SCA/FIA, while preserving the original AES goals of speed, low latency, and low power usage. We also offer high-performance software libraries and EDA tools for pre- and post-silicon security assessment.

Caliber interconnect Solutions provides full turnkey solutions ,from design through PCB FAB, and local Assembly with the highest industry standards ,for Medical, Military, and Automotive.

Analog and mixed-signal IC development company based in the Netherlands.

A leading fabless ASIC / SoC design service and silicon IP provider with 20 years of experience.

30 years producing Semiconductor test solutions (Hardware and Software). Design, Simulation, Manufacture, Assembly, Test Development and more, all by Synergie-CAD.

Bruco IC is a European fabless analog, mixed-signal and high-voltage IC Design Service company, offering exclusive solutions for the automotive, ISM and consumer market.

SmartSoC Solutions, a global company providing turnkey solutions for ASIC/SOC and Chip to Product, Digital Design (RTL, Verification, DFT, PD, Emulation, Validation) and Analog Mixed signal IP design (Circuit design and Mask Design).

Chipus (ISO 9001:2015 certified) provides full turnkey ASIC solutions, analog and mixed signal IP and design services in analog (design and layout) and digital domains (Modeling, RTL coding, verification and backend).

“SiPaaS” IP & ASIC solutions including licensable GPU, video, audio, AI/ML-NPU, ISP, compression, security, power, RF, mixed-signal and advanced packaging.