The Google of the Semiconductor Industry

Design, verification, and test of analog, digital, and mixed-signal ICs. Specialized in biomedical and optical applications. Premium partner of X-FAB.

Chipus (ISO 9001:2015 certified) provides full turnkey ASIC solutions, analog and mixed signal IP and design services in analog (design and layout) and digital domains (Modeling, RTL coding, verification and backend).

Seamlessly Bridging the Analogue and Digital Worlds for Tomorrow's Chiplet Solutions.

Struent Semiconductors is a Semiconductors startup based out of India, offering turnkey, Time & Material and custom business models for ASIC/SoC development, specializing in low-power and Lower Technology nodes.

ElectraIC develops ASIC / FPGA, microchip and embedded software/systems, electronic circuit design and verification projects.

Experior is dedicated to semiconductor testing. We provide one stop services in test design, development, validation and high volume testing.

Racyics is an experienced integrated circuit design service provider and GLOBALFOUNDRIES channel partner with focus on advanced semiconductor nodes.

Imec.IC-link is the semiconductor manufacturing division of imec. We help innovators, entrepreneurs and universities realize their ideas in silicon by providing low-cost prototyping, volume production and system integration of electronic assemblies.

More than 500 IC projects tape-out a year. Co-work with more than 300 companies and more than 700 universities.

Turnkey provider of packaging design, assembly and test services. Global operations include 11M ft2 of volume production, development, sales & support.

Kamaten primary business is development and maintenance of Analog and Mixed Signal IP portfolio. We are also a design service provider.

EnSilica expertise in the design and supply of custom analogue, mixed signal and digital IC’s in the consumer, automotive, industrial and communications markets.

“SiPaaS” IP & ASIC solutions including licensable GPU, video, audio, AI/ML-NPU, ISP, compression, security, power, RF, mixed-signal and advanced packaging.