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IOs and Library IP
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IC Failure Analysis Lab

USA

IC Failure Analysis Lab is a full-service provider of Failure Analysis and Qualification services to Semiconductors, Medicals, Telecommunications, and Automotive companies.

Services

Failure Analysis, Reliability and Qualification Testing

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Optocap

UK

Fast Turn IC Packaging (Same Day Turn Around Possible) & High Performance IC Packaging for Space & Other Hi-Rel Applications.

Services

Fast Turn IC Assembly & Packaging, Hi-Rel IC Assembly & Packaging, Flip Chip Assembly, Wire Bonding & Ribbon Bonding, Package Design Services

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MASER Engineering

The Netherlands

MASER Engineering is an independent engineering service company and We offer Reliability Test and Failure Analysis Services to the semiconductor and electronic systems industry.

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RoodMicrotec

Germany

RoodMicrotec provides SCM, Test, Qualification, Failure Analysis and Engineering services to automotive, aerospace, industrial, consumer, medical markets and fabless companies.

Services

Supply Chain Management Services – Turnkey Solutions, Engineering services, test program development, Qualification & Reliability investigations, Optomechanical qualifications, Failure & Technological analysis, Device testing, device programming, end-of-line services

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DELTA

DELTA Microelectronics

Denmark

DELTA provides IC design, testing, distribution, and complete supply chain services to some of the world’s best known OEMs/ODMs and fabless semiconductor companies.

Services

ASIC Design, Opto, Toll Road, RFID, Sensors, Test and Packaging, Qualification and Failure Analysis, Supply Chain Services, GLOBALFOUNDRIES Channel Partner

IP Cores

RFID analog front-end

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Nanoscope Services

UK

NanoScope is a European Focused Ion Beam Technology and TEM Microscopy service provider.

Services

Failure Analysis, Circuit Nano-edit, Reliability Testing, FIBxTEM Analysis

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ISS_logo_popular

Integrated Semiconductor Solutions

USA

Our core focus is to provide customers with semiconductor IC testing services they need. Such as ESD & LU testing, Burn-In & Product Reliability, Package Qualifications , Test Hardware and Manufacturing and ATE testing.


Services

IC Qualifications for ESD, Burn-in product, process, Reliability Qualification capability and capacity, Device Package Qualification Services including Preconditioning, Engineering and Hardware capabilities, IC Package Failure Analysis

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EAG, Inc.

USA

EAG's Microelectronics Test and Engineering team provides semiconductor and electronics design firms with test, debug, and early engineering support for new product introduction.

Services

ATE Test and Engineering, Burn-In & Reliability Qualification Services, ESD Testing & Latch-Up Testing Services, PCB Design & Assembly Services, FIB Circuit Edit and Debug Services, Failure Analysis Services

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