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QP Technologies

USA

QP Technologies provides wafer prep, prototype and small-volume IC packaging and assembly services. We specialize in delivering full turnkey solutions.

Services

IC Packaging, IC Assembly, Advanced Assembly, Substrate Design & Development, Wafer Preparation

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Beckermus Technologies

Israel

Beckermus Technologies (founded in 1998) provides full assembly and packaging services for Microelectronics, Micro Optics and Photonics.

Services

Microelectronic Assembly Services, ectro-Optics and Photonics Assembly Services , Electro Optical Design , Supply Chain Services , Wafer Level Services

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Chipus Microelectronics

Brazil

Chipus (ISO 9001:2015 certified) provides full turnkey ASIC solutions, analog and mixed signal IP and design services in analog (design and layout) and digital domains (Modeling, RTL coding, verification and backend).

Services

Full turnkey ASIC, IC design services, Analog and mixed signal IP, Supply Chain Management, Team augmentation

IP Cores

Power Management, Data Converters, Clock Management, Sensors , Front Ends

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Shanghai Peilun Semiconductor

China

Peilun is a worldwide ASIC design service provider, business model including ASIC turnkey solution, or FPGA to ASIC, or IP/customization.

Services

SoC Turnkey Service, IP or chip customization, SOC design platform

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DA-Integrated

Canada

DA-Integrated is a leading global provider of Comprehensive Production Test Solutions and Custom ASIC Design and Supply.

Services

ASIC Design and Supply, Comprehensive Test Solutions

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