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Featured Vendors

SmartSoC Solutions, a global company providing turnkey solutions for ASIC/SOC and Chip to Product, Digital Design (RTL, Verification, DFT, PD, Emulation, Validation) and Analog Mixed signal IP design (Circuit design and Mask Design).

XQWave

India

XQWave is a semiconductor consulting firm delivering end-to-end ASIC, embedded, and silicon solutions with deep industry expertise and proven execution.

iNPACK

Israel

Complete OSAT solution: Single Die, MCM, Packaging Design, Substrates and Miniaturized PCBs, 3D Packaging, Test Services, Full Turnkey.

GLOBALFOUNDRIES is the world’s first full-service semiconductor foundry with a truly global footprint.

Device Engineering is a Tempe, AZ, USA-based design and manufacturing facility specializing in Analog and Mixed-Signal Integrated Circuits.

SignOff Semiconductors

USA, India, Israel

SignOff Semiconductors is having best-in-class expertise in all aspects of ASIC / SOC Design Services from spec-to-silicon.

TES is a leading German ASIC Design House and IP company and provides embedded software, hardware, RF and antenna design services.

Chipus (ISO 9001:2015 certified) provides full turnkey ASIC solutions, analog and mixed signal IP and design services in analog (design and layout) and digital domains (Modeling, RTL coding, verification and backend).

Asicland

Republic of Korea

Asicland provides ASIC turnkey services as a TSMC VCA partner. Backed by 400+ tape-out records, we help customers accelerate reliable silicon projects, including tape-out support for design-complete projects.

CSEM

Switzerland

Leader in ultra low power analogue and mixed signal ASIC design and IP licensing, including RF, image sensor and SOC.

Integra Technologies and its full-turnkey capabilities of die preparation, packaging, testing and characterization of Hi-Rel semiconductor components and related value-added services.

Greenvity licenses HPGP PLC for automotive and RF transceivers for industrial IoT and provides custom mixed-signal & RF design services.

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