The Google of the Semiconductor Industry

VConneTech Systems is an engineering-driven technology company delivering end-to-end solutions across semiconductor design, embedded systems, AI, hardware engineering, and manufacturing.

We deliver industrial ASIC turnkey solutions from specification to mass production, leveraging over 10 foundries including the world's largest.

Xiphera develops hardware-based cryptographic IP cores, with a portfolio of 30+ solutions delivering high-performance, future-proof security for mission-critical systems.

Creonic is the leader in ready-for-use IP cores, offering a rich product portfolio for wired, wireless, fiber and free-space optical communications.

HCLTech is a leading ASIC Design services company with more than 27 years of experience in providing semiconductor services with focus on full Turnkey ASIC design service.

Tessolve is the market leader in providing engineering solution for silicon and systems development. We offer a unique combination of both pre-silicon and post silicon expertise to provide an efficient turnkey solution for silicon bring up, spec to product.

Neways Advanced Microsystems develops and produces functional plastic encapsulation solutions for MEMS and sensor systems for harsh environments like automotive motor oil applications.

Bruco IC is a European fabless analog, mixed-signal and high-voltage IC Design Service company, offering exclusive solutions for the automotive, ISM and consumer market.

As one of the leading independent fabless IC-Design institutions in Europe, Fraunhofer IIS offers turnkey solutions for customized mixed-signal ASICs and integrated sensor systems with over 30 years of experience.

Greenvity licenses HPGP PLC for automotive and RF transceivers for industrial IoT and provides custom mixed-signal & RF design services.

Key ASIC offers turnkey ASIC/SoC design services, specializing in AI, IoT, and medical applications with a focus on PPA optimization.

“SiPaaS” IP & ASIC solutions including licensable GPU, video, audio, AI/ML-NPU, ISP, compression, security, power, RF, mixed-signal and advanced packaging.