The Google of the Semiconductor Industry

CSS, a fabless semiconductor leader with 30 years of experience, develops and supplies mixed-signal ASICs to Industrial, Aerospace/Defense, and Medical markets.

We provide RFIC, analogue, and mixed signal ASIC design services focused on IoT sensor node design and other markets.

BTA specializes in ASIC and FPGA design services. We provide team augmentation and turnkey solutions with a high caliber, experienced team.

Established in 2003, KAL provides semiconductor deep tech consultancy and ASIC program management. KAL works with worldwide partners to deliver VLSI deep tech development, including digital, RF, and analog ASIC design services, supply chain services, IP cores, and libraries. We are capable of executing full spec to production projects and delivering fully tested ICs in high volume.

Complete OSAT solution: Single Die, MCM, Packaging Design, Substrates and Miniaturized PCBs, 3D Packaging, Test Services, Full Turnkey.

SignOff Semiconductors is having best-in-class expertise in all aspects of ASIC / SOC Design Services from spec-to-silicon.

Sofics is an IP provider improving reliability of ICs through innovative designs. Sofics offers 3 products: TakeCharge®, PowerQubic® and CustomIO®.

Racyics is an experienced integrated circuit design service provider and GLOBALFOUNDRIES channel partner with focus on advanced semiconductor nodes.

DA-Integrated is a leading global provider of Comprehensive Production Test Solutions and Custom ASIC Design and Supply.

Greenvity licenses HPGP PLC for automotive and RF transceivers for industrial IoT and provides custom mixed-signal & RF design services.

Creonic is the leader in ready-for-use IP cores, offering a rich product portfolio for wired, wireless, fiber and free-space optical communications.

RFIC Solutions designs disruptive MMIC SoCs for industries like 5G, Fixed Wireless Access, SATCOM, IOT, Wigig, Wireless Power Transfer, CATV, MIPI, etc. We have expertise in GaAs, GaN, SiGe BiCMOS, Silicon CMOS, other HBT processes as well as hybrid technologies like IPD/LTCC/Thick/Thin film/PCB.