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Featured Vendor

EquipIC Supply Chain

EquipIC Supply Chain

The Netherlands

ASIC supply chain partner with competitive solutions for IC manufacturing, packaging and test, lower volumes are welcome too.

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CAST, Inc.

CAST, Inc.

USA

CAST provides digital IP cores, including processors; video, image, and data compression; automotive and avionics buses; peripherals; and encryption.

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HDL Design House

HDL Design House

Serbia

HDL Design House delivers leading-edge digital, analog, and back-end design and verification services and products in numerous areas of SoC.

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Chipus Microelectronics

Chipus Microelectronics

Brazil

Chipus develops configurable IP core architectures that allow a good level of customization together with high IP portability, providing unique level of freedom on customer design requirements.

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AEMtec

AEMtec

Germany

AEMtec is the Strategic Technology Partner for advanced Microsystems, Opto-Electronics, Wafer back-end and Packaging Services.

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Semiconductor News

Achronix Selects Moortec’s 7nm Embedded Temperature Sensor to Optimise Performance and Reliability in its 4th Generation Speedster FPGA
Achronix Selects Moortec’s 7nm Embedded Temperature Sensor to Optimise Performance and Reliability in its 4th Generation Speedster FPGA
Worldwide IC Company Market by Location – 2018
Worldwide IC Company Market by Location – 2018
Morse Micro Partners with SiFive to Host Tech Symposium on RISC-V in Sydney
Morse Micro Partners with SiFive to Host Tech Symposium on RISC-V in Sydney
CSEM and MIFS demonstrate world-record lows in energy consumption for a microcontroller.
CSEM and MIFS demonstrate world-record lows in energy consumption for a microcontroller.
Can We Believe The Hype About China’s Domestic IC Production Plans?
Can We Believe The Hype About China’s Domestic IC Production Plans?
Silex Insight now supports 1GbE, 2.5GbE & 10GbE with their AV over IP OEM boards
Silex Insight now supports 1GbE, 2.5GbE & 10GbE with their AV over IP OEM boards
HDL Design House Adds New Representative in Europe
HDL Design House Adds New Representative in Europe
Overview and Types of Capacitors in ASIC Design
Overview and Types of Capacitors in ASIC Design

Latest Articles

ASIC Design

HDL Design House Adds New Representative in Europe
HDL Design House Adds New Representative in Europe
DARPA is set to revolutionize ASIC design
DARPA is set to revolutionize ASIC design
CEO Talk: Claude Joseph Cloutier
CEO Talk: Claude Joseph Cloutier

IP Cores

Achronix Selects Moortec’s 7nm Embedded Temperature Sensor to Optimise Performance and Reliability in its 4th Generation Speedster FPGA
Achronix Selects Moortec’s 7nm Embedded Temperature Sensor to Optimise Performance and Reliability in its 4th Generation Speedster FPGA
Cambricon employs Moortec’s embedded PVT Monitoring Subsystem IP to their Artificial Intelligence (AI) and Machine Learning Chips
Cambricon employs Moortec’s embedded PVT Monitoring Subsystem IP to their Artificial Intelligence (AI) and Machine Learning Chips
Creonic Launches 5G Product Line with Polar and LDPC FEC IP Cores
Creonic Launches 5G Product Line with Polar and LDPC FEC IP Cores

ASIC Industry Market Trends

Worldwide IC Company Market by Location – 2018
Worldwide IC Company Market by Location – 2018
TSV Integration is Creating Growth
TSV Integration is Creating Growth
U.S. Companies Maintain Largest Share of Fabless Company Semiconductor Sales
U.S. Companies Maintain Largest Share of Fabless Company Semiconductor Sales

Wafer and Foundries

Can We Believe The Hype About China’s Domestic IC Production Plans?
Can We Believe The Hype About China’s Domestic IC Production Plans?
300mm Silicon Wafers Market Overview
300mm Silicon Wafers Market Overview
CMOS Image Sensor Sales 2007-2022
CMOS Image Sensor Sales 2007-2022

Packaging

Short Guide to Selecting IC Package
Short Guide to Selecting IC Package
The Ultimate Guide to QFN Package
The Ultimate Guide to QFN Package
QFN Package Body Size and Lead Count – Infographics
QFN Package Body Size and Lead Count – Infographics

Verification

Sankalp Semiconductor Announces Availability of Automated Analog Validation Services Environment – SAVE
Sankalp Semiconductor Announces Availability of Automated Analog Validation Services Environment – SAVE
Efficient Verification and Virtual Prototyping of Analog and Mixed-Signal IP and SOCs Using Behavioral Models
Efficient Verification and Virtual Prototyping of Analog and Mixed-Signal IP and SOCs Using Behavioral Models
Don’t Get Critical IP Cores from a ‘Supermarket’
Don’t Get Critical IP Cores from a ‘Supermarket’

Testing

Presto Engineering’s Extensive Test Capabilities Enable It to Offer Customers Parallel Testing of Automotive Products to Provide Much Faster Time to Market
Presto Engineering’s Extensive Test Capabilities Enable It to Offer Customers Parallel Testing of Automotive Products to Provide Much Faster Time to Market
DA-Integrated Selects Chroma 3650 Test System
DA-Integrated Selects Chroma 3650 Test System
Mentor Graphics Acquires Galaxy Semiconductor
Mentor Graphics Acquires Galaxy Semiconductor

Qualification

Understanding High Temperature Storage Life (HTSL) in IC Qualification
Understanding High Temperature Storage Life (HTSL) in IC Qualification
Electrostatic Discharge vs Electromigration
Electrostatic Discharge vs Electromigration
What is a Burn-in Board?
What is a Burn-in Board?

Supply Chain

CoreHW and RoodMicrotec to establish long-term supply chain partnership
CoreHW and RoodMicrotec to establish long-term supply chain partnership
Understanding IC Cost
Understanding IC Cost
Chipmaker Allwinner is Enabling a $79 Laptop
Chipmaker Allwinner is Enabling a $79 Laptop

Failure Analysis

Best Practices: IC Troubleshooting & IC Failure Analysis
Best Practices: IC Troubleshooting & IC Failure Analysis
Focused Ion Beam (FIB)
Focused Ion Beam (FIB)
Why Dr. Morris Chang is not My Hero. A tribute to Failure Analysis Engineers
Why Dr. Morris Chang is not My Hero. A tribute to Failure Analysis Engineers
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