https://www.greenmountainsemi.com/

The Google of the Semiconductor Industry

Find ASIC design, layout and verification vendors:

Find IP Core Vendors:

Find MPW, Mask-Set and Wafer Vendors:

Find IC Package, Assembly and Substrate Vendors:

Find IC Testing, LoadBoard and ProbeCard Vendors:

Find Within All Vendors and Blog Pages:

Find Qualification and Failure Analysis Vendors:

Get prices from vendors within 24 hours Go

or contact us, we will find a vendor that matches you needs

Featured Vendor

Presto Engineering

Presto Engineering

USA

Presto Engineering, Inc. provides outsourced operations for semiconductor and IoT device companies, helping its customers minimize overhead, reduce risk and accelerate time-to-market.

View vendor page
Aptasic

Aptasic

Switzerland

Aptasic offers turnkey solutions to efficiently handle the ASIC supply chain (from wafer supply to good packaged ICs delivery). The company is ISO 9001:2008 certified (SQS) since 2006.

View vendor page
GF Micro

GF Micro

UK

We partner companies, start-ups and academia to design and develop innovative, leading-edge ASIC solutions across multi-domain applications.

View vendor page
Ambit Semiconductors

Ambit Semiconductors

India

Ambit offers semiconductor design and intellectual property design services to global clients and adopts Offshore Design Centre (ODC) approach in achieving this. ODC functions like an extended arm of the client and thus ensures close communication and coordination between the client's teams and ambitions.

View vendor page
AnalogueSmith

AnalogueSmith

Singapore

We provide RFIC, analogue, and mixed signal ASIC design services focused on IoT sensor node design and other markets.

View vendor page

Semiconductor News

Enabling security in embedded system using M.2 SSD
Enabling security in embedded system using M.2 SSD
NAND Flash to Lead All Others As IC Market Growth Returns in 2020
NAND Flash to Lead All Others As IC Market Growth Returns in 2020
IC’Alps granted ISO 13485:2016 certification for design and supply of Integrated Circuits for medical devices
IC’Alps granted ISO 13485:2016 certification for design and supply of Integrated Circuits for medical devices
Vehicle autonomy & electrification are pushing the adoption of advanced packaging
Vehicle autonomy & electrification are pushing the adoption of advanced packaging
Moortec’s In-Chip Monitoring Subsystem Supports Uhnder in Groundbreaking Digital Automotive Radar-on-Chip
Moortec’s In-Chip Monitoring Subsystem Supports Uhnder in Groundbreaking Digital Automotive Radar-on-Chip
Alereon Adopts Omni Design’s Low Power Analog-to-Digital and Digital-to-Analog Converters for Ultra-Wideband Applications
Alereon Adopts Omni Design’s Low Power Analog-to-Digital and Digital-to-Analog Converters for Ultra-Wideband Applications
A Historical Case for DFT – or how the verification Pilgrims didn’t do their jobs
A Historical Case for DFT – or how the verification Pilgrims didn’t do their jobs
Attopsemi Technology Attended 4th Japan SOI Symposium and Presented a Talk “I-fuse: A Disruptive OTP Technology”
Attopsemi Technology Attended 4th Japan SOI Symposium and Presented a Talk “I-fuse: A Disruptive OTP Technology”

Latest Articles

ASIC Design

IC’Alps granted ISO 13485:2016 certification for design and supply of Integrated Circuits for medical devices
IC’Alps granted ISO 13485:2016 certification for design and supply of Integrated Circuits for medical devices
Efficient Verification and Virtual Prototyping of Analog and Mixed-Signal IP and SOCs Using Behavioral Models
Efficient Verification and Virtual Prototyping of Analog and Mixed-Signal IP and SOCs Using Behavioral Models
CEO Talk: Claude Joseph Cloutier
CEO Talk: Claude Joseph Cloutier

IP Cores

Enabling security in embedded system using M.2 SSD
Enabling security in embedded system using M.2 SSD
Sonics Collaborates with GLOBALFOUNDRIES to Accelerate Adoption of Power and Performance Capabilities of the 22FDX® Process by SoC Designers
Sonics Collaborates with GLOBALFOUNDRIES to Accelerate Adoption of Power and Performance Capabilities of the 22FDX® Process by SoC Designers
The battery is dead; long live power management.
The battery is dead; long live power management.

ASIC Industry Market Trends

Top 15 Semiconductor Sales Leaders – 2019
Top 15 Semiconductor Sales Leaders – 2019
Top 5 Share of Semiconductor Industry Capex to Set New Record in 2019
Top 5 Share of Semiconductor Industry Capex to Set New Record in 2019
Semiconductor Fabless IC Company Sales Top $100 Billion for First Time Ever
Semiconductor Fabless IC Company Sales Top $100 Billion for First Time Ever

Wafer and Foundries

TSMC and GLOBALFOUNDRIES Announce Resolution of Global Disputes Through Broad Global Patent Cross-License
TSMC and GLOBALFOUNDRIES Announce Resolution of Global Disputes Through Broad Global Patent Cross-License
GlobalFoundries rumored to be acquired by the Chinese
GlobalFoundries rumored to be acquired by the Chinese
MRAM, a promise beyond eFlash
MRAM, a promise beyond eFlash

Packaging

Vehicle autonomy & electrification are pushing the adoption of advanced packaging
Vehicle autonomy & electrification are pushing the adoption of advanced packaging
Amkor Technology to Acquire NANIUM
Amkor Technology to Acquire NANIUM
Choose Through Silicon Via (TSV) Packaging for Improved Performance
Choose Through Silicon Via (TSV) Packaging for Improved Performance

Verification

Sankalp Semiconductor Announces Availability of Automated Analog Validation Services Environment – SAVE
Sankalp Semiconductor Announces Availability of Automated Analog Validation Services Environment – SAVE
Choosing the right VIP
Choosing the right VIP
ASIC Verification: Build or Simulate?
ASIC Verification: Build or Simulate?

Testing

A Historical Case for DFT – or how the verification Pilgrims didn’t do their jobs
A Historical Case for DFT – or how the verification Pilgrims didn’t do their jobs
Managing Semiconductor Test Data in Current Age
Managing Semiconductor Test Data in Current Age
Teradyne – Company Overview
Teradyne – Company Overview

Qualification

Understanding High Temperature Storage Life (HTSL) in IC Qualification
Understanding High Temperature Storage Life (HTSL) in IC Qualification
Moisture Sensitivity Level and Popcorn Effect
Moisture Sensitivity Level and Popcorn Effect
Understanding ESD HBM in IC Design
Understanding ESD HBM in IC Design

Supply Chain

Presto Adds New Executives to the Leadership Team
Presto Adds New Executives to the Leadership Team
CEO Talk: Rafi Albarian, Integra Technologies
CEO Talk: Rafi Albarian, Integra Technologies
Fabless Silicon Manufacture: Should Unit Cost Always Be Minimised?
Fabless Silicon Manufacture: Should Unit Cost Always Be Minimised?

Failure Analysis

Best Practices: IC Troubleshooting & IC Failure Analysis
Best Practices: IC Troubleshooting & IC Failure Analysis
Electrostatic Discharge vs Electromigration
Electrostatic Discharge vs Electromigration
Why Dr. Morris Chang is not My Hero. A tribute to Failure Analysis Engineers
Why Dr. Morris Chang is not My Hero. A tribute to Failure Analysis Engineers
Find Vendors IP Cores

Find ASIC Vendors

Find IP Vendors

Get Price Offers From
Welcome New Vendors
Answer a Question
Recent Semipedia Items
Recent Posts
Most Popular Blog Posts
Tools
AnySilicon

Copyright 2011-2019, AnySilicon. All rights reserved.

Follow Us

Semiconductor Services

We use cookies to ensure that we give you the best experience on our website. If you continue without changing your settings, we'll assume that you are happy to receive all cookies from this website.