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Featured Vendors

ams OSRAM

Austria

ams OSRAM, a global leader in light and sensor solutions with over 110 years of experience, combines engineering excellence and manufacturing to innovate in sensing, illumination, and visualization across various industries.

Device Engineering is a Tempe, AZ, USA-based design and manufacturing facility specializing in Analog and Mixed-Signal Integrated Circuits.

Xiphera

Finland

Xiphera develops hardware-based cryptographic IP cores, with a portfolio of 30+ solutions delivering high-performance, future-proof security for mission-critical systems.

Racyics

Germany

Racyics is an experienced integrated circuit design service provider and GLOBALFOUNDRIES channel partner with focus on advanced semiconductor nodes.

“SiPaaS” IP & ASIC solutions including licensable GPU, video, audio, AI/ML-NPU, ISP, compression, security, power, RF, mixed-signal and advanced packaging.

Digicomm Semiconductor is a specialized engineering firm providing advanced end-to-end ASIC design, Packaging, and embedded software services.

Swindon is a leader in the design, production test and supply of industrial and automotive mixed signal ASICs (Custom ICs).

RF Semiconductor characterization and training.

MinDCet

Belgium

MinDCet specializes in high-voltage, mixed-signal and power ASIC design and possesses internal production testing facilities for comprehensive solutions .

CMC helps researchers and industrial users develop innovations in microsystems and nanotechnologies.

TES is a leading German ASIC Design House and IP company and provides embedded software, hardware, RF and antenna design services.

Tekmos

USA

Tekmos delivers ASIC solutions replacing FPGAs, ASICs, Legacy Microprocessors and Flash Memory. Tekmos supports Defense, Medical and High Temperature applications.

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body{font-family:Arial,Helvetica,sans-serif;color:#222;line-height:1.72;margin:0;background:#fff} article{max-width:980px;margin:0 auto;padding:18px 18px 48px} h1{font-size:38px;line-height:1.18;margin:0 0 20px} h2{font-size:28px;line-height:1.3;margin:36px 0 14px}
Advanced packaging has become the place where AI system performance ...

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