ASIC Blog - Page 21 of 206

APlabs Chooses CAST IP Cores for Next-Generation Automotive SoC

Woodcliff Lake, New Jersey — April 12, 2023 — Semiconductor intellectual property provider CAST today announced that design services provider APlabs, Inc., has chosen CAST IP for a new automobile system-on-chip APlabs is developing for a major Korean automaker.

Repeat customer APlabs most recently licensed these cores from CAST

Tiempo Secure and GreenWaves Technologies demonstrate Secure Element role as Master in an embedded system

Grenoble, France – April 12, 2023 – Tiempo Secure and GreenWaves Technologies are proud to have demonstrated how a Secure Element brings additional security in a project supported by the French Government, the community of communes Grésivaudan and the Auvergne Rhone Alpes Region. While in classical architecture, developers of SoCs (System-on-Chips)

Steady growth in next-gen Fan-Out packaging

FO packaging revenue was US$1.86 billion in 2022. Yole Intelligence, part of Yole Group, expects it to have a CAGR of 12.5% through 2028, reaching US$3.8 billion. UHD FO will experience the fastest growth across all market classes, with a CAGR of 30%, growing from US$338 million in 2022 to

VeriSilicon collaborates with Microsoft to deliver Windows 10 to the Edge

Nuremberg, Germany, March 14, 2023–VeriSilicon (688521.SH) today announced its collaboration with Microsoft on Windows 10 IoT Enterprise platforms including hardware accelerators and long-term support for powerful embedded platforms. Leveraging VeriSilicon’s embedded software design capability and decades of experience in launching successful products, the company is enabling embedded applications developers and

Total Revenue of Top 10 Foundries Fell by 4.7% QoQ for 4Q22 and Will Slide Further for 1Q23, Says TrendForce

Mar. 13, 2023 —- According to TrendForce’s latest survey of the global foundry market, electronics brands began adjusting their inventories in 2Q22, but foundries were unable to rapidly adapt to this development because they reside in the more upper portion of the supply chain. Moreover, revising procurement quantities of long-term foundry contracts

Tiempo Secure announces TESIC RISC-V Secure Element IP and development kit

Grenoble, France – March 8, 2023 – As security is increasingly the central issue of any SoC (System on Chip) development, for example taking into account initiatives like the Cyber Resilience Act, Tiempo Secure has decided to enrich the RISC-V community with security expertise by developing a new version of its

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APlabs Chooses CAST IP Cores for Next-Generation Automotive SoC

Tiempo Secure and GreenWaves Technologies demonstrate Secure Element role as Master in an embedded system

Steady growth in next-gen Fan-Out packaging

VeriSilicon collaborates with Microsoft to deliver Windows 10 to the Edge

Total Revenue of Top 10 Foundries Fell by 4.7% QoQ for 4Q22 and Will Slide Further for 1Q23, Says TrendForce

Tiempo Secure announces TESIC RISC-V Secure Element IP and development kit

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Blog

APlabs Chooses CAST IP Cores for Next-Generation Automotive SoC

Tiempo Secure and GreenWaves Technologies demonstrate Secure Element role as Master in an embedded system

Steady growth in next-gen Fan-Out packaging

VeriSilicon collaborates with Microsoft to deliver Windows 10 to the Edge

Total Revenue of Top 10 Foundries Fell by 4.7% QoQ for 4Q22 and Will Slide Further for 1Q23, Says TrendForce

Tiempo Secure announces TESIC RISC-V Secure Element IP and development kit

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