This is a guest post by Richard McPartland, Technical Marketing Manager, Moortec
Chip designers working on advanced nodes typically include a fabric of sensors spread across the die for a number of very specific reasons. In this, the second of a three-part blog series Richard McPartland, Moortec’s Technical Marketing Manager
Cambridge, UK, 15 April 2020:
UltraSoC and Agile Analog today announced a collaboration that aims to deliver the industry’s most comprehensive hardware-based cybersecurity infrastructure by combining UltraSoC’s embedded on-chip analytics with Agile Analog’s advanced on-chip analog monitoring IP. The combination will enable the detection and prevention of ‘analog interference’
This is a guest post by Richard McPartland, Technical Marketing Manager, Moortec
The latest SoCs on advanced semiconductor nodes typically include a fabric of sensors spread across the die and for good reason. But why and what are the benefits? This first blog of a three-part series explores some
This is a guest post by Stephen Crosher, CEO of Moortec
As we move in to 2020 it’s clear that every sector of industry, including the semiconductor industry, will have a responsibility to address growing environmental concerns. We should be aware that as our sector underpins the growth in
Hsinchu, Taiwan (March 16, 2020) –eMemory, the world’s leading provider of intellectual property for non-volatile memory, today announced that its NeoMTP has been qualified on TSMC’s Third-Generation 0.18μm Bipolar-CMOS-DMOS (BCD) process to provide IoT power-management solutions and cost competitiveness.
eMemory’s NeoMTP is a popular choice for chip designers making
This is a guest post by Stephen Crosher, CEO of Moortec
The rate of product development is facing very real challenges as the pace of silicon technology evolution begins to slow. Today, we are squeezing the most out of transistor physics, which is essentially derived from 60-year-old CMOS technology.