Since mid of last year, our member ESPAT-Consulting is dedicating significant resources to SEMI Europe GmbH in Berlin, Germany, as one of the seven consortium core members of the EU CHIPS ACT driven Horizon Europe – Chips Joint Undertaking (JU) – Coordination and Support Action (CSA) – Project Pack4EU (Link: https://pack4eu.eu/). He is asking
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TEMPE, Ariz.–(BUSINESS WIRE)–Jan. 16, 2024– Amkor Technology, Inc. (Nasdaq: AMKR), a leading provider of semiconductor packaging and test services, and GlobalFoundries (GF), one of the world’s leading semiconductor manufacturers, will officially kick off their strategic partnership in Europe with a ribbon cutting ceremony at Amkor’s Porto, Portugal, facility on January 16, 2024.
Since February 2023, GF
TEMPE, Ariz.–(BUSINESS WIRE)–Nov. 30, 2023– Amkor Technology, Inc. (Nasdaq: AMKR), a leading provider of semiconductor packaging and test services, has announced its plan to build an advanced packaging and test facility in Peoria, Arizona. By the time of full project completion, Amkor projects to invest approximately $2 billion and employ
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Flip chip , also known as “controlled-collapse chip connection” (C4), is an advanced semiconductor packaging technique that allows the direct attachment of a semiconductor chip, typically an integrated circuit (IC), to a substrate or circuit board. Unlike traditional packaging methods like wire bonding, in flip chip technology, the active side
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Semiconductor packaging is a crucial aspect of electronics manufacturing that involves enclosing semiconductor chips in protective and functional packages to ensure their reliability, performance and integration into electronic devices. These packages serve as a bridge between the tiny, sensitive semiconductor chips and the broader electronic systems, providing electrical connections, thermal
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Tell us a bit about yourself and your background
I have worked in the semiconductor industry for 20+ years. I started at Texas Instruments where I held roles in engineering and marketing analog Integrated Circuits (ICs). After 12 years at TI, I joined Amkor where I currently hold P&L