TEMPE, Ariz. and DRESDEN, Germany, February 16, 2023 — Amkor Technology, Inc. (Nasdaq: AMKR), a leading provider of semiconductor packaging and test services, and GlobalFoundries (Nasdaq: GFS) (GF), a global leader in feature-rich semiconductor manufacturing, announced today that the two companies have formed a strategic partnership. This new partnership will enable
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TEMPE, Ariz. — October 24, 2022 — Amkor Technology, Inc. (Nasdaq: AMKR), a leading provider of semiconductor packaging and test services, today announced its commitment to supporting European initiatives to achieve strategic regionalization for automotive semiconductors.
The proliferation of applications for automotive semiconductors continues to accelerate — from electrification,
Since March 2020, the pandemic has brought on scarcity in odd goods like toilet paper, baking flour and exercise equipment. The latest casualty is the auto industry as car production across the world has been hobbled by chip shortages. While much has been written about the role of semiconductor suppliers,
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System in Package (SiP) is a method used for bundling multiple integrated circuits (ICs) and passive components into a single package, under which they all work together. This contrasts to a System on Chip (SoC), whereas the functions on those chips are integrated into the same die.
Figure
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Wafer Level Packaging or WLP, is a type of IC packaging technology that is performed at wafer level. This means that the packaging is applied on whole wafers and wafers are diced only after the packaging is successfully competed. In wafer level packaging, the components used in assembly (such as
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First introduced by Bell Labs in 1957, wire bonding is an integrated circuit (IC) manufacturing method used in more than 40 billion microelectronic devices each year. Wire bonding is used extensively for interconnecting semiconductor chips to package leads and many other applications that allow RF devices to meet stringent size,
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