Category Archives: Packaging
Fan-Out is becoming imperative to stay competitive within the advanced packaging industry
“Fan-Out Packaging is now a must-have in the portfolio to stay competitive,” asserts Favier Shoo, Technology & Market Analyst and part of the Semiconductor & Software team at Yole Développement (Yole). “New milestones are achieved by SEMCO and PTI with FOPLP technology. Both companies have invested and developed FOPLP for
Read MoreAn Introduction to BGA Package
With the levels of integration rising to unprecedented levels and the requirement of integrated circuits with a high number gate and pins increased day by day, there was a need to manufacture a package that would be convenient to use, would be will reliable and robust, would pose higher pin
Read MoreAmkor Offers Optical Package Solutions for Multiple Applications
Amkor Technology, a leading provider of outsourced semiconductor assembly and test (OSAT) services, today announced the extension of its MEMS and Sensor package platforms to address the growing optical market. The new optical package platforms are derivatives of our successful ChipArray® BGA and MicroLeadFrame® product families and can be used for many applications including
Read MoreBeckermus Technologies Announces Partnership with Engage Photonics
Beckermus Technologies was founded in 1998 and serves as an Excellence Center in the field of “Bare Die” assembly services for micro-electronic and micro-optical systems. Beckermus Technologies has been playing a vital role in the lifecycle of many products, for numerous companies worldwide, from early prototypes to mass production.
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IC Packaging: consumer solutions are adapted for automotive applications
“Automotive is the new El Dorado for microelectronics,” announces Emilie Jolivet, Director, Semiconductor & Software at Yole Développement (Yole). The market is showing significant market drivers that are daily supporting the growth: electrification, connectivity, autonomy and comfort are the key words of the today’s automotive industry.
Under this dynamic context, the market research
Amkor Introduces TOLL & PSMC Packages for Automotive Applications
The TOLL package is a highly efficient space-saving package featuring extremely low Rds(on) and strong thermal performance making it well suited for high current and high voltage applications. It meets an existing JEDEC package outline, is 30% smaller and 50% thinner than a DDPAK package. The TOLL package leads are designed with wettable flanks
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