News Archive

Photonics packaging heads toward a $14.4 billion market by 2031

fiber optic


Integrating photonic devices into reliable, scalable modules and systems is still one of the industry’s most complex challenges. Yet that same complexity is also creating value, with the photonics packaging market projected to reach $14.4 billion by 2031.
 


Today’s insights highlight key trends explored in Yole Group’s latest report, Photonics Packaging

Read More

CAST Debuts TSN-EP-10G IP for High-Performance, Time-Sensitive Networking Ethernet Designs

Woodcliff Lake, NJ — March 11, 2026 — CAST, a leading provider of semiconductor intellectual property cores, today announced the TSN-EP-10G Time-Sensitive Networking (TSN) Endpoint IP core, extending its established TSN portfolio to support 10-Gigabit Ethernet (10 Gbps) for automotive, industrial automation, aerospace, rail, marine, and defense markets.
 
CAST’s new TSN-EP-10G targets high-bandwidth, time-synchronized

Read More

TES Unveils High-Performance 8/40MHz Oscillator and Clock Buffer IPs for Reliable On-Chip Timing Solutions for X-FAB XT018 – 0.18µm BCD-on-SOI technology.

news

TES Electronic Solutions GmbH announces the release of two new high-performance timing IP cores, the TS_XOSC_40M_X8 Pierce Oscillator and the TS_CLKBUF_25pF_X8 Clock Buffer, designed to deliver precise, reliable, and efficient clock generation and distribution for mixed-signal and digital systems. Together, these IP cores form a complete clocking solution in X-FAB XT018-0.18µm BCD-on-SOI CMOS process, ideal

Read More

CAST Introduces 400 Gbps UDP/IP Hardware Stack IP Core for High-Performance ASIC Designs

press release

Woodcliff Lake, NJ — March 10, 2026 — CAST, a long-established provider of semiconductor intellectual property cores, today announced a new hardware UDP/IP protocol stack IP core that enables data transfer at speeds up to 400 Gbps in ASIC implementations.
 
Designed for standalone operation, the new UDPIP-400G-ASIC core offloads UDP/IP encapsulation and related protocol processing

Read More

SignOff Semiconductors Participates in IESA Vision Summit 2026 – Bengaluru, India

news

SignOff Semiconductors participated in the IESA Vision Summit 2026, held on 25–26 February at The Leela Bhartiya City Convention Centre, Bengaluru. Organized by the India Electronics and Semiconductor Association (IESA), the summit brought together leaders from across the semiconductor and electronics ecosystem – including policymakers, global technology companies, startups, academia, and industry experts.
 

Read More

Global Semiconductor Market grows 26% in 2025 to $796 billion

wafer

Global semiconductor sales reached USD 795.6 billion in 2025, representing an increase of 26.2 percent year-over-year and marking one of the strongest annual expansions in the industry’s history. Growth accelerated over the course of the year, culminating in Q4 2025 revenues of USD 238.9 billion, up 38.4 percent compared to Q4 2024, reflecting strong demand across several key

Read More
Logo Image
Privacy Overview

This website uses cookies so that we can provide you with the best user experience possible. Cookie information is stored in your browser and performs functions such as recognising you when you return to our website and helping our team to understand which sections of the website you find most interesting and useful.