May 8, 2026 — SCALINX today announced its integration in the GlobalFoundries (GF) GlobalSolutions™ Ecosystem, reinforcing a long‑standing collaboration to support the design and manufacturing of advanced mixed‑signal System‑on‑Chip (SoC) solutions based on high‑speed data converter technologies.
As part of this collaboration, SCALINX is now listed on the GlobalSolutions Ecosystem partner portal, providing customers with streamlined access to its
May 12, 2026 – Chips&Media (CEO Steve Kim, KOSDAQ: 094360), a leading global provider of video IP technology, announced today that it has completed the development of its hardware IP supporting AV2, the next-generation high-efficiency video codec from AOMedia (Alliance for Open Media). This development positions Chips&Media at the epicenter of the global video standards competition,
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Mannheim, Germany — May 12, 2026 — EXTOLL, a leading provider of high-speed and ultra-low-power SerDes and Chiplet connectivity, announces the availability and readiness for customer integration of the industry´s first 16G UCIe PHY IP in GlobalFoundries´ 22FDX/22FDX+ technology.
The IP marks a significant milestone in chiplet interconnectivity for mainstream foundry nodes. It is optimized for standard
SANTA CLARA, Calif., May 11, 2026 (GLOBE NEWSWIRE) — Building on more than 30 years of collaboration, Applied Materials, Inc. today announced a new innovation partnership with TSMC to accelerate the development and commercialization of semiconductor technologies required for the next era of AI. Working together at Applied’s EPIC Center in Silicon Valley, the companies will co-innovate to advance materials
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WASHINGTON—May 4, 2026—The Semiconductor Industry Association (SIA) today announced global semiconductor sales were $298.5 billion during the first quarter of 2026, an increase of 25% compared to Q4 of 2025. Global sales were $99.5 billion during the month of March 2026, an increase of 79.2% compared to the March 2025 total of $55.5 billion and
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30 April 2026 — TrendForce’s latest foundry industry findings point out that AI demand has surged rapidly since 2023, leading to capacity bottlenecks in 3 nm–2 nm wafers and 2.5D/3D advanced packaging. The shortage of CoWoS has persisted, extending upstream to production equipment and downstream to substrates, packaging materials, and other critical components.
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