Semiconductor entrepreneur and compute/memory hardware specialist joins to lead product strategy across AI data centres, automotive and Physical AI platforms, bringing experience across Cambridge neuromorphic research, venture-building at Deep Science Ventures, enterprise AI infrastructure and edge computing.
LONDON, United Kingdom, 1 June 2026: Analogue Insight, a UK semiconductor design company specialising in high-speed analogue
Advanced Semiconductor Engineering, better known as ASE, has announced the development of an automated 310mm × 310mm panel-level packaging production line. The move is another sign that advanced packaging is becoming a critical part of semiconductor scaling, especially for AI processors, high-performance computing devices and chiplet-based architectures.
For years, the semiconductor industry relied mainly
May 26th, 2026 — ASML expects the first semiconductor products manufactured using its next-generation High-NA EUV lithography machines to arrive within months, marking an important milestone for advanced chip manufacturing. The update comes at a time when the semiconductor industry is debating not whether High-NA EUV will be needed, but when
May 26th, 2026 — Intel is already looking beyond its upcoming 18A and 14A process technologies, with early development reportedly underway for future 10A and 7A nodes. The update signals that Intel Foundry wants to show customers a long-term advanced-node roadmap extending into the next decade, even as the company continues to work through the
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TEMPE, Ariz.–(BUSINESS WIRE)–May 19, 2026– Amkor Technology, Inc. (Nasdaq: AMKR) today reinforced its commitment to expanding Advanced semiconductor packaging and test capabilities in the United States through continued investment in its Arizona manufacturing footprint.
Located within Peoria’s Innovation Core, Amkor’s campus is being developed on a 104-acre site designed to support large-scale, leading-edge semiconductor
Wilmington, MA & Milpitas, CA — May 19 2026
Addresses a critical challenge in AI – delivering high-density, energy-efficient compute as power and thermal demands limit system scale
Further advances ADI’s position as a leading strategic, system-level grid-to-core power partner for hyperscalers and AI