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It has been almost two decades since the target impedance concept was first proposed for the design of power distribution networks. Both academia and industry have come a long way since then by proposing solutions for managing power integrity in packages and printed circuit boards (PCB). This paper briefly reviews
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Firstly let me ask what strikes your mind first when I say performance?
Intel started designing processors with MHz to GHz frequencies (Improving the performance of course, but if we see the advantage there might be some flaws too). Yes serially it was possible to send and receive the data
Hundreds of jobs are under threat after Texas Instrument announced the closure of its Greenock factory.
TI said it would be closing the fab over the next three years, and moving its operations to fabs in Germany, Japan and Maine, in order to save money. Approximately 400 people are
QFN Package Overview
The QFN (Quad Flat No-lead) package is probably the most popular semiconductor package today because of four reasons: low cost, small form factor and good electrical and thermal performance. In this article we will provide an overview to QFN packaging, discuss QFN package technical details and
As semiconductor industry continues on its path to improve its productivity and profitability, the industry faces roadblocks due to huge capital investments with poor RoI. For past few decades ITRS has provided guidance to the research community and associated funding agencies worldwide, in setting up technological challenges and driving progress
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The IC Price Calculator is based on a standard price model that consists of all the required steps in IC manufacturing:
Wafer Price
Assembly/Package Price
Test Price
Yield
The IC Price Calculator is very easy to use and provides quick price estimate of IC price.
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Cisco Systems has acquired semiconductor company Leaba Semiconductor for $350-$400 million. Leaba was established in 2014 and operates in stealth mode.
According to Leaba’s website “Leaba is a fabless semiconductor company providing innovative solutions for significant infrastructure challenges. Leaba is backed by blue-chip investors and led by seasoned entrepreneurs
The leading nanoelectronics research center, imec, and digital research and incubation center, iMinds, today announced that its respective board of directors have approved the intention to merge the research centers. Using the imec name, the combined entities will create a world-class, high-tech research center for the digital economy. The transaction
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Since the invention of the first semiconductor package in 1965, the semiconductor packaging technology has grown dramatically and several thousands of different semiconductor package types have been made. The chart below presents the semiconductor packaging history. Particularly it shows the two major trends in semiconductor packaging: addressing high pin
Research in the field of 2D materials that started approximately five years ago, focusing on developing materials that are one layer thick which would make it faster for atoms to move in a single layer. Currently, transistors and other components used in electronic devices have been made of 3D materials
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