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Arm Holdings Plc has terminated its architectural license agreement with Qualcomm Inc., ending Qualcomm’s ability to use Arm’s intellectual property for chip design. The termination, reported by Bloomberg, follows a 60-day notice from Arm. This action escalates an existing legal dispute between the two companies, set to begin in Delaware
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Shanghai, China, October 22, 2024–VeriSilicon (688521.SH) today announced that its DeWarp Processing IP DW200-FS has achieved ISO 26262 ASIL B automotive functional safety certification. The certificate was issued by TÜV NORD, an international inspection and certification institution.
VeriSilicon’s DW200-FS IP leverages advanced pixel mapping algorithms and cache-based data prefetch architecture,
Today, the Biden-Harris Administration announced that the U.S. Department of Commerce and Wolfspeed, Inc. have signed a non-binding preliminary memorandum of terms (PMT) to provide up to $750 million in proposed direct funding under the CHIPS and Science Act. The proposed funding would support the construction of a new silicon
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Imagine a world where electronic devices are exponentially more powerful yet astonishingly compact. This is the promise of 2.5D packaging, an innovative approach to semiconductor design. It’s reshaping the landscape of computing, from smartphones to servers.
In the realm of electronics, understanding the building blocks is key.
[Santa Clara, USA], [October 21st, 2024] – MosChip® Technologies is now an AI/ML design partner under Renesas RZ partner ecosystems, delivering intelligent solutions based on Renesas RZ/V series of MPUs.
MosChip® Technologies is a semiconductor design and product engineering services company with expertise in SoC design, systems, software, mobility, connectivity,
Taiwan Semiconductor Manufacturing Company (TSMC) today announced that customer inquiries for its next-generation 2nm process are exceeding even those for its already successful 3nm technology. This exceptional demand underscores the industry’s confidence in TSMC’s technological leadership and its ability to meet the rapidly growing needs of the AI and high-performance
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Seoul, South Korea, Oct 23, 2024—Chips&Media (C&M), a global leader in video codec IP and application-specific NPU IP, today announced the WAVE6 Gen2+ series, a new multi-standard video codec hardware IP based on the next-generation video codec IP platform WAVE6.
The WAVE6 Gen2+ series is a newly designed IP
October 17, 2024 – Taiwan Semiconductor Manufacturing Company (TSMC) today reported strong third-quarter 2024 earnings, exceeding guidance and fueled by robust demand for high-performance computing (HPC) chips, particularly in the artificial intelligence (AI) sector. However, the company also highlighted challenges related to inventory levels, rising costs, and the ramp-up of
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October 17, 2024 — EnSilica, a leading chip maker of mixed signal ASICs (Application Specific Integrated Circuits), is pleased to announce that it has been awarded a design and supply contract for a mixed signal controller ASIC to be used in automotive and industrial motorised actuators. The European based client (the
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October 15, 2024 – Xscape Photonics, a pioneer in next-generation data center connectivity, today announced the closing of a $44 million Series A funding round, bringing its total funding to $57 million. The round was led by IAG Capital Partners and included participation from Cisco Systems Inc., Nvidia Corp., Altair
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