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Introduction to System in Package (SiP)

System in Package (SiP) is a method used for bundling multiple integrated circuits (ICs) and passive components into a single package, under which they all work together. This contrasts to a System on Chip (SoC), whereas the functions on those chips are integrated into the same die.
 

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Understanding Wafer Level Packaging

Wafer Level Packaging or WLP,  is a type of IC packaging technology that is performed at wafer level. This means that the packaging is applied on whole wafers and wafers are diced only after the packaging is successfully competed. In wafer level packaging, the components used in assembly (such as

Silex Insight launches DDR encrypter for High-Performing Systems (ASIC/FPGA)

Silex Insight, a leading provider of cryptographic IP solutions, is now extending their offering by launching a high throughput DDR encrypter (100Gbps). The DDR encrypter IP Core module enables on-the-fly encryption and authentication to the external memory. It is highly configurable and may be optimized for various size, throughput, and

Semicondcutor Foundry Sales Forecast 2016-2022

IC Insights’ forecast for the foundry market through 2026 was part of its recently released 1Q Update to the 2022 McClean Report.  The Update also included analyses of the top-25 2021 semiconductor suppliers, semiconductor industry capital spending, IC industry capacity, the automotive IC market, and detailed forecasts for the DRAM, flash, MCU, MPU, and analog

Semi Industry Capex Forecast to Jump 24% and Reach Over $190 Billion This Year

Figure 1 shows that after surging 36% in 2021, semiconductor industry capital spending is forecast to jump 24% in 2022 to a new all-time high of $190.4 billion, up 86% from just three years earlier in 2019. Moreover, if capital spending increases by ≥10% in 2022, it would mark the

Silicon Wafer Cost

Wafer cost is a critical component of IC cost calculation. Wafer cost is based on 4 main factors: wafer technology node, e.g. 5nm, 65nm, 130nm, etc. Wafer options/features, e.g. all the options required on top of the plain vanilla, e.g. mim cap, flash, high voltage, etc. Wafer volume, e.g. how

Introduction to Physical Design

There are numerous steps that are involved in the design of digital (or mixed signal) circuits starting from system specifications right till the chip is manufactured. One of these steps is a process of transforming a functionally described circuit (normally in netlist) into physical layout at the lowest level (normally

Wire Bonding for High-Reliability RF Device Applications

First introduced by Bell Labs in 1957, wire bonding is an integrated circuit (IC) manufacturing method used in more than 40 billion microelectronic devices each year. Wire bonding is used extensively for interconnecting semiconductor chips to package leads and many other applications that allow RF devices to meet stringent size,

Introduction to Intel Foundry Services

This is not the first foray for Intel in the foundry services space. Back in 2013, Intel made its first attempt and started offering production of chips for Altera using the 14nm process. Soon after a couple more companies were announced to have partnered with the Intel Custom Foundry division:

Semiconductor Sales To Rise at 7.1% CAGR Through 2026

The report forecasts total semiconductor sales will rise 11% this year following a very strong 25% increase in 2021 and an 11% increase in 2020.  If achieved, it would mark the first time since 1993-1995 that the semiconductor market has enjoyed three consecutive years of double-digit growth.  From 2016-2021, the