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Faraday Technology Corporation(TWSE: 3035), a leading ASIC design service and IP provider, and United Microelectronics Corporation (NYSE: UMC; TWSE: 2303) (“UMC”), a leading global semiconductor foundry, today announced the availability of Faraday’s fundamental IP on UMC’s 22nm ultra-low-power (ULP) and ultra-low-leakage (ULL) processes. The silicon-proven 22ULP/ULL fundamental IP, including multi-Vt
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Meyreuil, France – November 12, 2019—Presto Engineering, an outsourced operations provider to semiconductor and Internet of Things (IoT) device manufacturers, has achieved EAL6 (Evaluation Assurance Level 6) — an assurance and independent verification of very high levels of security to protect valuable data.
“Presto Engineering is a secured application
SAN JOSE, Calif. — November 11, 2019 — eSilicon, a leading provider of FinFET ASICs, market-specific IP platforms and advanced 2.5D packaging solutions, announced today the signing of a definitive agreement with Inphi Corporation (NYSE: IPHI) to acquire eSilicon. Concurrently, Synopsys, Inc. (Nasdaq: SNPS) announced the signing of a definitive agreement
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SmartDV™ Technologies will exhibit at SemIsrael Expo 2019 in Airport City, Israel, November 19 and ICCAD China 2019 November 21-22 in Nanjing, China.
At both events, SmartDV will showcase why it is the Proven and Trusted choice for Verification and Design Intellectual Property (IP), including new additions to its
Santa Clara, California (November 5, 2019) – Marvell (NASDAQ: MRVL) today announced that it has completed its acquisition of Avera Semiconductor, the Application Specific Integrated Circuit (ASIC) business of GLOBALFOUNDRIES. After working capital adjustments, the net deal consideration of approximately $600 million is being funded by a short-term bridge loan. By
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IC Insights’ November Update to The McClean Report 2019 will include a capital spending forecast for the major semiconductor companies for 2019 and 2020. In January of next year, IC Insights will release The McClean Report 2020 and present its seminars that review the five-year forecasts for the IC industry.
The share of semiconductor industry capital
Hsinchu, Taiwan R.O.C. and Santa Clara, CA, Oct. 29, 2019 – TSMC and GLOBALFOUNDRIES (GF) today announced they are dismissing all litigation between them as well as those that involve any of their customers. The companies have agreed to a broad life-of-patents cross-license to each other’s worldwide existing semiconductor patents as
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Belgium, October 28, 2019 – Sofics bvba (www.sofics.com), a leading semiconductor integrated circuit IP provider announced that its TakeCharge® Electrostatic Discharge (ESD) portfolio is silicon proven on TSMC’s advanced 16nm, 12nm and 7nm FinFET processes. More than 80 fabless companies use Sofics solutions to enable higher performance, higher robustness and
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October 22, 2019 — OPENEDGES Technology, Inc. the leading IP provider of Memory subsystem IP today announced a partnership with INNOSILICON to promote OPENEDGES DDR memory controller and INNOSILICON DDR PHY. The Companies have validated the interoperability between OPENEDGES DDR3/4/LPDDR3/4 memory controller and INNOSILICON DDR3/4/LPDDR3/4 PHY.
INNOSILICON is a world-class,
Leading-edge processes (<28nm) took over as the largest portion in terms of monthly installed capacity available in 2015. By the end of 2019, <28nm capacity is forecast to represent about 49% of the IC industry’s total capacity, based on information in IC Insights’ Global Wafer Capacity 2019-2023 report. At the very leading
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