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With the levels of integration rising to unprecedented levels and the requirement of integrated circuits with a high number gate and pins increased day by day, there was a need to manufacture a package that would be convenient to use, would be will reliable and robust, would pose higher pin
Read MoreFaraday Technology Corporation (TWSE: 3035), a leading ASIC design service and IP provider, today announced that it has won and delivered several factory automation (FA) related ASIC projects, supporting real-time Ethernet, EtherCAT, Profibus, and PLC controllers. In each case, Faraday employs its value-added ASIC and IP customization service for power-performance
Read MoreVeriSilicon today announced that industry leader Broadcom Inc. has selected its Vivante VIP8000/VIPNano family of Artificial Intelligence (AI) Processor IP for use in their next generation Set-top Box system-on-chip (SoC). With full scalability from extremely low power sub TOPS to high performance exceeding 100 TOPS, Vivante VIP8000/VIPNano IP has been
Read MoreIC Insights is in the process of completing its forecast and analysis of the IC industry and will present its new findings in The McClean Report 2019, which will be published later this month. Among the semiconductor industry data included in the new 400+ page report is an in-depth analysis of
Read MoreWith the IC market on pace to surpass the $400 billion mark in 2018 after exceeding $300 billion just one year earlier, it is not surprising that fab capacity levels are on the rise too. A surge in new fab construction and existing fab upgrades is underway, but will it
Read MoreSpare cells are basically elements embedded in the design which are not driving anything. The idea is that maybe they will enable an easy (metal) fix without the need of a full redesign.
Sometimes not everything works after tape-out, a counter might not be reseted correctly, a control signal
Imagine that you and your friends are ASIC engineers and you come up with a revolutionary idea for a semiconductor chip which could potentially change our life. You finally agree to start a company and start the ASIC development. But how will you manufacture the silicon wafers? do you need
Read MoreIC Insights is in the process of revising its forecast and analysis of the IC industry and will present its new findings in The McClean Report 2019, which will be published in January 2019. Among the revisions is a complete update of forecast growth rates of the 33 main product categories classified
Read MoreAmkor Technology, a leading provider of outsourced semiconductor assembly and test (OSAT) services, today announced the extension of its MEMS and Sensor package platforms to address the growing optical market. The new optical package platforms are derivatives of our successful ChipArray® BGA and MicroLeadFrame® product families and can be used for many applications including
Read MoreMoortec, provider of complete In-Chip Monitoring PVT Subsystems announced today that Credo has utilised Moortec’s Temperature Sensor and Voltage Monitor IP to optimise performace and increase reliability in their latest generation of SerDes chips.
Credo offers high-performance, mixed-signal semiconductor solutions including advanced serializer-deserializer (SerDes) IP and interconnect