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Our Capabilities, Flip-chip capabilities, Dealing with larger scale dies, COTS and custom solutions to meet the toughest expectations, Upholding the highest quality standards, System in package
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Substrate and Packaging Design, Advanced Packaging Assembly, Substrate Manufacturing, Packaging Services, Full Turn Key
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Test Engineering, Package Design / Selection, IC Reliability Tests Management, Supply Chain Management
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SoC Verification, IP Level Verification, FPGA Prototyping, ASIC Implementation
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