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Intellectual Property (IP) & Process Technology, SoC/ASIC Development Platform, Design Flow, Packaging & Testing, Production Service, Application-Oriented Value-Added Services
USB3.1 Gen1 IP Solutions, Technology Optimized Standard Cell Library, ESD Robust Multi-Voltage I/O, Low Power SRAM with High Production Yield
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ASIC Turnkey Service, Libraries Development Service, VLSI Design Service , Layout & Backend Service, IP Cores , Consultancy
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Wafer Processing, Test Services, COB/COF/MCM, SMT & Module Assembly, IC Packaging
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Custom Analog Mixed-Signal ASIC Solutions, ASIC, SoC, FPGA Design Services, Design Verification, Silicon Validation, IC Design Services, DFT Services
Microcontrollers and IDE solution, Custom Memory IP and I/Os, DDR3/DDR2 Memory Controller, 3D Graphics Processor for Wearables/IoT, Gigabit Ethernet PHY Cores, Wired and Wireless Connectivity
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Package Design Services, Package Assembly Services, High Temperature Design and Package Assembly, Electrical Test and Device Characterization, Wafer Probe, Device Qualification
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