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PEILUN

Shanghai Peilun Semiconductor

China

Peilun is a worldwide ASIC design service provider, business model including ASIC turnkey solution, or FPGA to ASIC, or IP/customization.

Services

SoC Turnkey Service, IP or chip customization, SOC design platform

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Tessolve Semiconductor

USA

Tessolve is the market leader in providing engineering solution for silicon and systems development. We offer a unique combination of both pre-silicon and post silicon expertise to provide an efficient turnkey solution for silicon bring up, spec to product.

Services

Design Verification, Physical Design , Design for Test (DFT) , Analog & Mixed Signal (AMS) Design, Embedded & Product Engineering Services

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Aemtec

AEMtec

Germany

AEMtec is the Strategic Technology Partner for advanced Microsystems, Opto-Electronics, Wafer back-end and Packaging Services.

Services

Development and Process Engineering, High Standard of Technological Equipment, Wafer Back-End Services

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Faraday logo

Faraday Technology Corporation

Taiwan

A leading fabless ASIC / SoC design service and silicon IP provider with 20 years of experience.

Services

Intellectual Property (IP) & Process Technology, SoC/ASIC Development Platform, Design Flow, Packaging & Testing, Production Service, Application-Oriented Value-Added Services

IP Cores

USB3.1 Gen1 IP Solutions, Technology Optimized Standard Cell Library, ESD Robust Multi-Voltage I/O, Low Power SRAM with High Production Yield

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Asicland

Republic of Korea

Asicland provides ASIC turnkey services as a TSMC VCA partner. Backed by 400+ tape-out records, we help customers accelerate reliable silicon projects, including tape-out support for design-complete projects.

Services

GDS Hand-off Wafer Production, Spec-in services, Front-end & Back-end Design, Foundry Manufacturing, Packaging, Test & Reliability

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