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France
Teledyne e2v offers a range of semiconductor services, including high-reliability assembly and test, high-performance package design and long-term support.
We are specialist of flip-chip assembly for the space market, including very large dies. We offer hermetic ceramic assembly or organic.
Our plant is QML-V and QML-Y certified.
Our Capabilities, Flip-chip capabilities, Dealing with larger scale dies, COTS and custom solutions to meet the toughest expectations, Upholding the highest quality standards, System in package
View vendor pagePIC Design Service, PIC Consultancy Service, PIC Testing Service (Die and Wafer level), PIC Packaging Service, PIC Manufacturing Service, PIC Training Service
View vendor pageIndia
SeviTech Systems provides full-chip design services, VIP solutions & unique software toolkits for fast and efficient implementation of complex ASIC, SoC & FPGAs for its global customers.
SoC Verification, IP Level Verification, FPGA Prototyping, ASIC Implementation
View vendor pageUSA
Green Mountain Semiconductor provides full custom circuit design and layout services, from individual expert contracting to turn-key product development.
AI Circuit Design, Analog & Mixed Signal Design, Emerging Memory Development, Special Purpose Applications, Interface Solutions
View vendor pageThe Netherlands
ASIC supply chain partner with competitive solutions for IC manufacturing, packaging and test, lower volumes are welcome too.
Foundry services and foundry adapted IP solutions, Packaging services, Test solutions, Supply Chain
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