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USA
QP Technologies provides wafer prep, prototype and small-volume IC packaging and assembly services. We specialize in delivering full turnkey solutions.
IC Packaging, IC Assembly, Advanced Assembly, Substrate Design & Development, Wafer Preparation
View vendor pageIndia
Vervesemi is developing high performance Analog IPs and ASICs for sensors and wireless applications, exploiting the expertise of state-of-the-art data converters and differentiated Analog.
GHz ADC and DAC for 5G, Radar applications, 24b ADC and AFE for sensor, medical, Industrial process control, seismic & metering business, 12b 16b ADC, AFE for embedded microcontroller, precision motor control applications, Mic Bias, 18b Audio ADC and 24b Audio DAC for audio and ANC applications, ADC and DAC for WIFI, Bluetooth, DOSCIS, STB applications, Precision reference, RC oscillator, crystal oscillator, charge pump, LDO, Temperature sensor, Bandgap, power on reset, Charge pump, Programmable gain amplifier, High valued ICs
View vendor pageLithuania
ASIC design service and silicon IP provider specializing in analog/mixed-signal and RF design (GNSS, RFID, telecom, medical, sensors).
Turnkey ASIC Design, IP Blocks Design, Radioelectronic Devices Development
RF Transceivers, PLL, ADC, Process, Voltage and Temperature Sensors (PVT sensor/detector/controller), RFID (UHF tag, ID card, NFC, medical implants), Energy harvesting (power converters from RF-field to voltage and current)
View vendor pageUSA
Tekmos delivers ASIC solutions replacing FPGAs, ASICs, Legacy Microprocessors and Flash Memory. Tekmos supports Defense, Medical and High Temperature applications.
FPGA to ASIC Conversion and Replacement, Turnkey ASIC Design and Manufacturing, Legacy Microprocessor Replacement, Analog/Mixed Signal ASIC Design and Manufacturing , Defense, Medical and High Temperature Applications, Legacy FLASH Memory Replacement
Legacy Microcontroller Families, Analog Blocks, FLASH Memory, Serial Interface Modules
View vendor pageGlobal
Cyient Semiconductors is a fabless provider delivering custom ASICs, ASSPs, and custom products with end-to-end design and global engineering expertise.
Turnkey ASIC Programs, ASIC Architecture & Front‑End Design, Physical Design & IC Layout, Verification, DFT & Sign‑Off, Manufacturing, Test & Qualification Management, Program & Supply‑Chain Integration
Third‑Party IP Integration & Enablement, Interface IP & Subsystem Integration (Controller + PHY Enablement)
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