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Packaging & Assembly, Electrical Wafer Sort & Final Test, Qualification & Failure Analysis, Fast-turn IC Assembly & Prototyping, Long-term Storage – Thermal-Absorptive Gas-Barrier, Back-end Turnkey Solutions – OSAT Services
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Custom ASIC Design, ASIC Design Services, Silicon IP Licensing and Design, Supply Chain Services (Turnkey), Product Design (Hardware & Software), Antenna Design
RF & PLL, Analog – PLL, Analog - ADC, Analog – Interface, Analog – Misc, Power, Digital
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Turnkey ASIC / SOC Development, Technology Development Platform, Technology Development Platform, Analog Circuit Design, Integrated Circuit Layout, Digital Design (RTL Design) and Verification, Digital Physical Design
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Semiconductor Packaging, Packaging Technology, Design Services, Test Services, Turnkey Services
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Our Capabilities, Flip-chip capabilities, Dealing with larger scale dies, COTS and custom solutions to meet the toughest expectations, Upholding the highest quality standards, System in package
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