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Inpack

iNPACK

Israel

Complete OSAT solution: Single Die, MCM, Packaging Design, Substrates and Miniaturized PCBs, 3D Packaging, Test Services, Full Turnkey.

Services

Substrate and Packaging Design, Advanced Packaging Assembly, Substrate Manufacturing, Packaging Services, Full Turn Key

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DA-Integrated

Canada

DA-Integrated is a leading global provider of Comprehensive Production Test Solutions and Custom ASIC Design and Supply.

Services

ASIC Design and Supply, Comprehensive Test Solutions

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Tekmos

USA

Tekmos delivers ASIC solutions replacing FPGAs, ASICs, Legacy Microprocessors and Flash Memory. Tekmos supports Defense, Medical and High Temperature applications.

Services

FPGA to ASIC Conversion and Replacement, Turnkey ASIC Design and Manufacturing, Legacy Microprocessor Replacement, Analog/Mixed Signal ASIC Design and Manufacturing , Defense, Medical and High Temperature Applications, Legacy FLASH Memory Replacement

IP Cores

Legacy Microcontroller Families, Analog Blocks, FLASH Memory, Serial Interface Modules

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QP Technologies

QP Technologies

USA

QP Technologies provides wafer prep, prototype and small-volume IC packaging and assembly services. We specialize in delivering full turnkey solutions.

Services

IC Packaging, IC Assembly, Advanced Assembly, Substrate Design & Development, Wafer Preparation

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Analogue Insight

UK

Seamlessly Bridging the Analogue and Digital Worlds for Tomorrow's Chiplet Solutions.

Services

Partnership Programs, Standard Chiplet Design, Custom SoC and IP Design & Licensing, Comprehensive Design Services, Consulting

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