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Substrate and Packaging Design, Advanced Packaging Assembly, Substrate Manufacturing, Packaging Services, Full Turn Key
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Custom Analog Mixed-Signal ASIC Solutions, ASIC, SoC, FPGA Design Services, Design Verification, Silicon Validation, IC Design Services, DFT Services
Microcontrollers and IDE solution, Custom Memory IP and I/Os, DDR3/DDR2 Memory Controller, 3D Graphics Processor for Wearables/IoT, Gigabit Ethernet PHY Cores, Wired and Wireless Connectivity
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Consulting, Electrical Test Implementation, Screening and Qualification, Industrialization, Wafer Supply, Manufacturing
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Turnkey ASIC / SOC Development, Technology Development Platform, Technology Development Platform, Analog Circuit Design, Integrated Circuit Layout, Digital Design (RTL Design) and Verification, Digital Physical Design
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GDS Hand-off Wafer Production, Spec-in services, Front-end & Back-end Design, Foundry Manufacturing, Packaging, Test & Reliability
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