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Substrate and Packaging Design, Advanced Packaging Assembly, Substrate Manufacturing, Packaging Services, Full Turn Key
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Advanced packaging Services, Semiconductor test services, Mechanical, electrical and thermal modeling, Analytical services, reliability and failure analysis
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ASIC, SOC design, Foundry services, Turn key (supply chain management), Package and testing , TSMC’s official VCA (Value Chain Aggregator) , MPW and mini ASIC Services
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Turnkey ASIC Programs, ASIC Architecture & Front‑End Design, Physical Design & IC Layout, Verification, DFT & Sign‑Off, Manufacturing, Test & Qualification Management, Program & Supply‑Chain Integration
Third‑Party IP Integration & Enablement, Interface IP & Subsystem Integration (Controller + PHY Enablement)
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Our Capabilities, Flip-chip capabilities, Dealing with larger scale dies, COTS and custom solutions to meet the toughest expectations, Upholding the highest quality standards, System in package
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