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Partnership Programs, Standard Chiplet Design, Custom SoC and IP Design & Licensing, Comprehensive Design Services, Consulting
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Package Design Services, Package Assembly Services, High Temperature Design and Package Assembly, Electrical Test and Device Characterization, Wafer Probe, Device Qualification
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Wafer Processing, Test Services, COB/COF/MCM, SMT & Module Assembly, IC Packaging
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ICs Design Service, ICs Layout Design Service, Power Management Circuit Consulting and Development, Analog Layout Resource Rraining, Automatic Test Equipment Full Support
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ASIC Design, ASIC Production, ASIC Production Management, Replacement of Obsolete Components
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