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Our Capabilities, Flip-chip capabilities, Dealing with larger scale dies, COTS and custom solutions to meet the toughest expectations, Upholding the highest quality standards, System in package
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IC and Board Level Reliability, Failure Analysis & Eng Samples Preparation, FIB Circuit Edits Down to 3nm Process and Wafer Surface , Analog Design, ASIC Design and Supply Chain
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Wafer Storage & Processing, Assembly Services, Electrical Test Services, Analytical Services, Reliability Testing
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Design Services
Standard Cells Libraries, TCAM & CAM, SRAM & ROM, Custom PDK and PCELL, Register Files
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Implementation Feasibility, ASIC Concept, ASIC Design, ASIC Manufacturing, Assembly and Test, ASIC Qualification and Failure Analysis , ASIC Logistics
Low-Noise and Low-Power Front-End Amplifiers, High-Precision Analog-to-Digital Converters, Voltage Regulators and Charge Pumps, Custom IP Solutions
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