75 results found
Advanced ASIC Development, New Product Introduction (NPI) Engineering, High Volume Manufacturing (HVM) Enablement
HBM3 PHY & Controller, Non-Coherent Network-on-Chip (NOC), Coherent Network-on-Chip (NOC), DDR5/4 PHY & Controller, Die-to-Die (D2D) Interconnect, Analog & Configurable I/Os
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General-Purpose I/O (GPIO), ESD Protection , High-speed I/O, Memory Interfaces, Special
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CC EAL5+ certification of customer chips, Secure personalization of customer chips
TESIC RISC-V CC EAL5+ Secure Element, TESIC CC EAL5+ Secure Element
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IP Customization, Low power, small footprint Design Methodology, Integration Services on Customer FPGA Boards, System Design, Consulting
IEEE 802 Data Center and Wireless FEC , OpenZR+/ Open ROADM oFEC 800GbE, SDA, ITU High-Speed Optical Communication IP Cores, Full ETSI DVB-S2X Wideband Transmitter and Receiver, AWGN Channel, 3GPP Mobile Communications
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