80 results found
IC/SoC design, Fabrication, Packaging & Testing, SYSTEM SOFTWARE, IOT SERVICES
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Advanced ASIC Development, New Product Introduction (NPI) Engineering, High Volume Manufacturing (HVM) Enablement
HBM3 PHY & Controller, Non-Coherent Network-on-Chip (NOC), Coherent Network-on-Chip (NOC), DDR5/4 PHY & Controller, Die-to-Die (D2D) Interconnect, Analog & Configurable I/Os
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ASIC Design , Testing and Packaging, Qualification and Failure Analysis, Supply Chain Management, IoT Operations Outsourcing Solutions, RF and Mixed-Signal Test, Front-end Tape-out, Mask and Wafer Procurement, Back-end Manufacturing and Test, GLOBALFOUNDRIES Channel Partner
RFID analog front-end
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IP Customization, Low power, small footprint Design Methodology, Integration Services on Customer FPGA Boards, System Design, Consulting
IEEE 802 Data Center and Wireless FEC , OpenZR+/ Open ROADM oFEC 800GbE, SDA, ITU High-Speed Optical Communication IP Cores, Full ETSI DVB-S2X Wideband Transmitter and Receiver, AWGN Channel, 3GPP Mobile Communications
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1G to 1,000Gbps Interlaken IP cores, 1G to 400Gbps Ethernet IP Cores, Low latency Ethernet for Financial Markets
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