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Analog and Mixed-Signal Circuits, Digital Systems and Data Processing, Wireline Communications, Radio Frequency Integrated Circuits, ASIC Foundry Services, Integrated Sensor Systems
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Substrate and Packaging Design, Advanced Packaging Assembly, Substrate Manufacturing, Packaging Services, Full Turn Key
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Package Design Services, Package Assembly Services, High Temperature Design and Package Assembly, Electrical Test and Device Characterization, Wafer Probe, Device Qualification
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Physical Design, STA & Synthesis, Flow Development, RTL Design & Integration, DFT, Design Verification, Circuit and Layout Design, Turnkey Solutions / IP Services
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Design Services
Standard Cells Libraries, TCAM & CAM, SRAM & ROM, Custom PDK and PCELL, Register Files
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