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The Netherlands
Neways Advanced Microsystems develops and produces functional plastic encapsulation solutions for MEMS and sensor systems for harsh environments like automotive motor oil applications.
Packaging & Assembly
View vendor pageChina
Analog, digital, SOC, ASIC wafer and IC testing, SOP/ESOP packaging, fingerprint strip testing, and wafer to COB/PCBA mass production.
Wafer Processing, Test Services, COB/COF/MCM, SMT & Module Assembly, IC Packaging
View vendor pageRepublic of Korea
Asicland provides ASIC turnkey services as a TSMC VCA partner. Backed by 400+ tape-out records, we help customers accelerate reliable silicon projects, including tape-out support for design-complete projects.
GDS Hand-off Wafer Production, Spec-in services, Front-end & Back-end Design, Foundry Manufacturing, Packaging, Test & Reliability
View vendor pageUSA
Green Mountain Semiconductor provides full custom circuit design and layout services, from individual expert contracting to turn-key product development.
AI Circuit Design, Analog & Mixed Signal Design, Emerging Memory Development, Special Purpose Applications, Interface Solutions
View vendor pageUSA
Microtek provides optimum microelectronics packaging solutions focusing on the design, engineering and manufacturing of R&D level projects.
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