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Chipus Microelectronics

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Beckermus Technologies

Israel

Beckermus Technologies (founded in 1998) provides full assembly and packaging services for Microelectronics, Micro Optics and Photonics.

Services

Microelectronic Assembly Services, ectro-Optics and Photonics Assembly Services , Electro Optical Design , Supply Chain Services , Wafer Level Services

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CMC Microsystems

CMC Microsystems

Canada

CMC helps researchers and industrial users develop innovations in microsystems and nanotechnologies.

Services

Fabrication Services, CAD Services, R&D Services

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easii ic logo

EASii IC

France

EASii IC is a design house developing high performances ASIC, from 0.35µm down to 10nm, including FD-SOI.

Services

ASIC design, ASIC verification, System validation and industrialization , Full turnkey

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Criteria Labs

USA

Full turn-key solution and service provider specializing in package design, package assembly, qualification/upscreening, and RF/Electrical testing.

Services

Package Design Services, Package Assembly Services, High Temperature Design and Package Assembly, Electrical Test and Device Characterization, Wafer Probe, Device Qualification

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QP Technologies

QP Technologies

USA

QP Technologies provides wafer prep, prototype and small-volume IC packaging and assembly services. We specialize in delivering full turnkey solutions.

Services

IC Packaging, IC Assembly, Advanced Assembly, Substrate Design & Development, Wafer Preparation

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