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Israel
Complete OSAT solution: Single Die, MCM, Packaging Design, Substrates and Miniaturized PCBs, 3D Packaging, Test Services, Full Turnkey.
Substrate and Packaging Design, Advanced Packaging Assembly, Substrate Manufacturing, Packaging Services, Full Turn Key
View vendor pageUSA
Packet Digital has a team of skilled engineers ready to help design, verify, and implement your FPGA or ASIC solution. Specializing in analog and mixed-signal designs, the team can take your design from requirements capture to customer delivered silicon.
Analog Circuit Design, Digital & Mixed Signal Design, Verification, Concept to Silicon
View vendor pageIsrael
Beckermus Technologies (founded in 1998) provides full assembly and packaging services for Microelectronics, Micro Optics and Photonics.
Microelectronic Assembly Services, ectro-Optics and Photonics Assembly Services , Electro Optical Design , Supply Chain Services , Wafer Level Services
View vendor pageChina
SMIC is one of the leading semiconductor foundries, providing integrated circuit (IC) foundry and technology services at 0.35um to 40nm.
Advanced Logic - 40nm, 65/55nm, Mature Logic - 90nm, 0.13um/0.11um, Mature Technology 0.18μm, 0.35μm, Non-Volatile Memory, Analog/Power, Turnkey Services
View vendor pageBelgium
AnSem is a leading fabless analog ASIC Design Service company, offering full turnkey analog, RF and mixed-signal integrated circuits to customers worldwide.
Full turnkey, ASIC Definition, Custom IC and ASIC design, Prototype Manufacturing and Evaluation, ASIC Industrialization, Supply Chain Management
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