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France
Teledyne e2v offers a range of semiconductor services, including high-reliability assembly and test, high-performance package design and long-term support.
We are specialist of flip-chip assembly for the space market, including very large dies. We offer hermetic ceramic assembly or organic.
Our plant is QML-V and QML-Y certified.
Our Capabilities, Flip-chip capabilities, Dealing with larger scale dies, COTS and custom solutions to meet the toughest expectations, Upholding the highest quality standards, System in package
View vendor pageSweden
SGA designs and manufactures mixed-signal, full-custom ASIC's for primarily industrial applications world-wide.
ASIC Design and Supply, Analog and mixed-signal circuits
View vendor pageUSA
Full turn-key solution and service provider specializing in package design, package assembly, qualification/upscreening, and RF/Electrical testing.
Package Design Services, Package Assembly Services, High Temperature Design and Package Assembly, Electrical Test and Device Characterization, Wafer Probe, Device Qualification
View vendor pageUSA
Rochester provides a range of manufacturing services, such as wafer storage, die processing, design, assembly, electrical testing, failure analysis, and reliability testing.
Wafer Storage & Processing, Assembly Services, Electrical Test Services, Analytical Services, Reliability Testing
View vendor pageUSA
Turnkey provider of packaging design, assembly and test services. Global operations include 11M ft2 of volume production, development, sales & support.
Semiconductor Packaging, Packaging Technology, Design Services, Test Services, Turnkey Services
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