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Our Capabilities, Flip-chip capabilities, Dealing with larger scale dies, COTS and custom solutions to meet the toughest expectations, Upholding the highest quality standards, System in package
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ASIC Design, ASIC Production Testing, Measurement Systems
GaN Gate Driver, SiC Gate Driver
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ASIC Design , Testing and Packaging, Qualification and Failure Analysis, Supply Chain Management, IoT Operations Outsourcing Solutions, RF and Mixed-Signal Test, Front-end Tape-out, Mask and Wafer Procurement, Back-end Manufacturing and Test, GLOBALFOUNDRIES Channel Partner
RFID analog front-end
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Advanced packaging Services, Semiconductor test services, Mechanical, electrical and thermal modeling, Analytical services, reliability and failure analysis
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Advanced Logic - 40nm, 65/55nm, Mature Logic - 90nm, 0.13um/0.11um, Mature Technology 0.18μm, 0.35μm, Non-Volatile Memory, Analog/Power, Turnkey Services
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