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Criteria Labs

USA

Full turn-key solution and service provider specializing in package design, package assembly, qualification/upscreening, and RF/Electrical testing.

Services

Package Design Services, Package Assembly Services, High Temperature Design and Package Assembly, Electrical Test and Device Characterization, Wafer Probe, Device Qualification

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Inpack

iNPACK

Israel

Complete OSAT solution: Single Die, MCM, Packaging Design, Substrates and Miniaturized PCBs, 3D Packaging, Test Services, Full Turnkey.

Services

Substrate and Packaging Design, Advanced Packaging Assembly, Substrate Manufacturing, Packaging Services, Full Turn Key

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Device Engineering

Device Engineering Incorporated

USA

Device Engineering is a Tempe, AZ, USA-based design and manufacturing facility specializing in Analog and Mixed-Signal Integrated Circuits.

Services

Analog & Mixed Signal IC Design Services – Sample Capabilities, Design & Layout Tools, RF ASIC Design & Wireless Integrated Circuits, RF ASIC Design Tools, Analog Semi-Custom Arrays (700 Series), Analog Semi-Custom Arrays (Data Archive)

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ic haus logo

iC-Haus

Germany

iC-Haus GmbH is a leading independent German manufacturer of application-specific standard iCs (ASSPs) and customized ASiC semiconductor solutions. Our proprietary cell libraries in CMOS, Bipolar, and BCD technologies are used in smart sensor, laser/opto, and actuator iCs.

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ams OSRAM

ams OSRAM

Austria

ams OSRAM, a global leader in light and sensor solutions with over 110 years of experience, combines engineering excellence and manufacturing to innovate in sensing, illumination, and visualization across various industries.

Services

Implementation Feasibility, ASIC Concept, ASIC Design, ASIC Manufacturing, Assembly and Test, ASIC Qualification and Failure Analysis , ASIC Logistics

IP Cores

Low-Noise and Low-Power Front-End Amplifiers, High-Precision Analog-to-Digital Converters, Voltage Regulators and Charge Pumps, Custom IP Solutions

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