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Our Capabilities, Flip-chip capabilities, Dealing with larger scale dies, COTS and custom solutions to meet the toughest expectations, Upholding the highest quality standards, System in package
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Development and Process Engineering, High Standard of Technological Equipment, Wafer Back-End Services
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Fabless Semicoductor Supplier, Design Services – Analog & Digital ASIC design, Design Services – FPGAs, Design Services – IC Lifecycle Management – EOL Redesign
Analog IP Cores, Digital IP Cores
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SoC Verification, IP Level Verification, FPGA Prototyping, ASIC Implementation
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