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USA
Mirafra is a global Engineering Services company with expertise in Semiconductor Design & Verification, Embedded and Application Software services.
Design Verification, Design Implementation (RTL to GDSII), RTL Design, Design for Test (DFT), Analog & Mixed Signal Design, Emulation and Post Silicon Validation
View vendor pagePIC Design Service, PIC Consultancy Service, PIC Testing Service (Die and Wafer level), PIC Packaging Service, PIC Manufacturing Service, PIC Training Service
View vendor pageUSA
Microtek provides optimum microelectronics packaging solutions focusing on the design, engineering and manufacturing of R&D level projects.
China
Peilun is a worldwide ASIC design service provider, business model including ASIC turnkey solution, or FPGA to ASIC, or IP/customization.
SoC Turnkey Service, IP or chip customization, SOC design platform
View vendor pageIsrael
Beckermus Technologies (founded in 1998) provides full assembly and packaging services for Microelectronics, Micro Optics and Photonics.
Microelectronic Assembly Services, ectro-Optics and Photonics Assembly Services , Electro Optical Design , Supply Chain Services , Wafer Level Services
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