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QP Technologies

QP Technologies

USA

QP Technologies provides wafer prep, prototype and small-volume IC packaging and assembly services. We specialize in delivering full turnkey solutions.

Services

IC Packaging, IC Assembly, Advanced Assembly, Substrate Design & Development, Wafer Preparation

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mindcet logo

MinDCet

Belgium

MinDCet specializes in high-voltage, mixed-signal and power ASIC design and possesses internal production testing facilities for comprehensive solutions .

Services

ASIC Design, ASIC Production Testing, Measurement Systems

IP Cores

GaN Gate Driver, SiC Gate Driver

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Amkor Technology

Amkor Technology Inc.

USA

Turnkey provider of packaging design, assembly and test services. Global operations include 11M ft2 of volume production, development, sales & support.

Services

Semiconductor Packaging, Packaging Technology, Design Services, Test Services, Turnkey Services

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PEILUN

Shanghai Peilun Semiconductor

China

Peilun is a worldwide ASIC design service provider, business model including ASIC turnkey solution, or FPGA to ASIC, or IP/customization.

Services

SoC Turnkey Service, IP or chip customization, SOC design platform

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TES Electronic Solutions

TES Electronic Solutions

Germany

TES is a leading German ASIC Design House and IP company and provides embedded software, hardware, RF and antenna design services.

Services

ASIC design and supply chain management, ASIC design services

IP Cores

Video and Graphics, Digital IP, Analog IP

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