The Google of the Semiconductor Industry

Provides our customers unsurpassed service in ASIC design services, analog, mixed-signal and RF design, verification, layout, validation, testing, cost reduction, embedded firmware and applications leading to customer success.

Innovative Data Conversion Microelectronics. Our high-performance/low-power data converter IP and other analog/mixed-signal products and design services will shorten your time-to-market.

AnSem is a leading fabless analog ASIC Design Service company, offering full turnkey analog, RF and mixed-signal integrated circuits to customers worldwide.

ASIC design service and silicon IP provider specializing in analog/mixed-signal and RF design (GNSS, RFID, telecom, medical, sensors).

Imec.IC-link is the semiconductor manufacturing division of imec. We help innovators, entrepreneurs and universities realize their ideas in silicon by providing low-cost prototyping, volume production and system integration of electronic assemblies.

More than 500 IC projects tape-out a year. Co-work with more than 300 companies and more than 700 universities.

Noesis Technologies is a Silicon IP provider specialized in hardware implementation of complex telecom algorithms for wireless and wireline applications.

Neways Advanced Microsystems develops and produces functional plastic encapsulation solutions for MEMS and sensor systems for harsh environments like automotive motor oil applications.

Chips&Media is a leading semiconductor HW IP provider specializing in multimedia IPs, video codecs, and deep learning-based upscaling super-resolution.

EKSS Microelectronics was established in 2002 and provides Complex IC Product and Test Engineering, Assembly,Supply Chain Services & Consultancy to the Fabless Semiconductor & IC Design House community.

“SiPaaS” IP & ASIC solutions including licensable GPU, video, audio, AI/ML-NPU, ISP, compression, security, power, RF, mixed-signal and advanced packaging.

Creonic is the leader in ready-for-use IP cores, offering a rich product portfolio for wired, wireless, fiber and free-space optical communications.

Turnkey provider of packaging design, assembly and test services. Global operations include 11M ft2 of volume production, development, sales & support.