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Featured Vendors

Asicland

Republic of Korea

Asicland provides ASIC turnkey services as a TSMC VCA partner. Backed by 400+ tape-out records, we help customers accelerate reliable silicon projects, including tape-out support for design-complete projects.

ChipGlobe

Germany

ChipGlobe offers ASIC/FPGA Design Services in Design Centers in Munich, Belgrade, Singapore: RTL2GDS, Functional Verification, Embedded Systems + Prototypes.

ams OSRAM

Austria

ams OSRAM, a global leader in light and sensor solutions with over 110 years of experience, combines engineering excellence and manufacturing to innovate in sensing, illumination, and visualization across various industries.

SmartSoC Solutions, a global company providing turnkey solutions for ASIC/SOC and Chip to Product, Digital Design (RTL, Verification, DFT, PD, Emulation, Validation) and Analog Mixed signal IP design (Circuit design and Mask Design).

Taiwan Technology Innovations (TTI) provide quality and cost-effective outsourced semiconductor assembly and testing services to customer.

InCirT

Germany

InCirT is a German company that provides ultra-wideband data converters, ultra-low jitter programmable PLLs, high-speed interface, and many other IPs.

Provides our customers unsurpassed service in ASIC design services, analog, mixed-signal and RF design, verification, layout, validation, testing, cost reduction, embedded firmware and applications leading to customer success.

BitSim Now

Sweden

Develops electronics for sensors, cameras and image processing. We also offers customized Machine Vision solutions.

HCLTech

Global

HCLTech is a leading ASIC Design services company with more than 27 years of experience in providing semiconductor services with focus on full Turnkey ASIC design service.

Greenvity licenses HPGP PLC for automotive and RF transceivers for industrial IoT and provides custom mixed-signal & RF design services.

Know-how and lengthy experience is what makes us successful in the design of analog, digital and Mixed-Signal ASICs. Your partner for future-oriented, Cost-optimized ASIC solutions.

iNPACK

Israel

Complete OSAT solution: Single Die, MCM, Packaging Design, Substrates and Miniaturized PCBs, 3D Packaging, Test Services, Full Turnkey.

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