Featured Vendor

Chipus Microelectronics

Brazil

Chipus develops configurable IP core architectures that allow a good level of customization together with high IP portability, providing unique level of freedom on customer design requirements.

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MAK

Sweden

MAK AB is specialized in advanced IC assembly, prototyping services and low volume production for semiconductor companies.

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IBM Canada Ltd

Canada

IBM in Bromont is a world leader in semiconductor packaging technology and now known for our next generation photonic solutions.

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Beckermus Technologies

Israel

Beckermus Technologies (founded in 1998) provides full assembly and packaging services for Microelectronics, Micro Optics and Photonics.

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SMART Microsystems

USA

SMART Microsystems works with Design Engineers who need high-quality, low volume microelectronic sub-assemblies for their innovative new products.

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