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Featured Vendors

ShortLink

Sweden

Specialists in developing silicon designs (ASIC) for portable and wireless applications. Focus on low power and miniaturization with a broad portfolio of IP building blocks.

DXCorr designs memory compilers as well as standard cell libraries to meet the stringent requirements for SoC designs.

Swindon is a leader in the design, production test and supply of industrial and automotive mixed signal ASICs (Custom ICs).

IMMS GmbH

Germany

Design, verification, and test of analog, digital, and mixed-signal ICs. Specialized in biomedical and optical applications. Premium partner of X-FAB.

CoreHW

Finland

CoreHW is your one-stop custom ASIC solution partner. CoreHW can create your exclusive ASIC in a flash with our broad IP portfolio and partner network. CoreHW is ISO9001:2015 certified company.

NTLab

Lithuania

ASIC design service and silicon IP provider specializing in analog/mixed-signal and RF design (GNSS, RFID, telecom, medical, sensors).

SEMICONDUCTORS BACK-END SERVICES: IC’s Testing, IC’s Packaging, IC’s qualification-Reliability, IC’s Supply Chain and PCB Design and Fabrication.

Presto Engineering, provides ASIC design and outsourced operations for semiconductor and IoT device companies, helping its customers minimize overhead, reduce risk and accelerate time-to-market.

KARMIC Design Private Ltd is a pioneer and leader in the semiconductor design and development industry. We have expertise in Analog, RF/mmwave, Mixed Signal, Memory ,IO and Digital domains; providing design services and solutions globally. We also provide Embedded/Firmware support and Board testing.

RoodMicrotec

Germany

RoodMicrotec provides SCM, Test, Qualification, Failure Analysis and Engineering services to automotive, aerospace, industrial, consumer, medical markets and fabless companies.

RFIC Solutions designs disruptive MMIC SoCs for industries like 5G, Fixed Wireless Access, SATCOM, IOT, Wigig, Wireless Power Transfer, CATV, MIPI, etc. We have expertise in GaAs, GaN, SiGe BiCMOS, Silicon CMOS, other HBT processes as well as hybrid technologies like IPD/LTCC/Thick/Thin film/PCB.

Integra Technologies and its full-turnkey capabilities of die preparation, packaging, testing and characterization of Hi-Rel semiconductor components and related value-added services.

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