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Featured Vendors

Amkor Technology Inc.

USA

Turnkey provider of packaging design, assembly and test services. Global operations include 11M ft2 of volume production, development, sales & support.

iNPACK

Israel

Complete OSAT solution: Single Die, MCM, Packaging Design, Substrates and Miniaturized PCBs, 3D Packaging, Test Services, Full Turnkey.

GEDEC

Italy

GEDEC (GEnova DEsign Center) is an independent electronic system and integrated circuit design house, mainly focused in advanced electronic and ICs microelectronics design.

InCirT

Germany

InCirT is a German company that provides ultra-wideband data converters, ultra-low jitter programmable PLLs, high-speed interface, and many other IPs.

Analogue Insight

UK

Seamlessly Bridging the Analogue and Digital Worlds for Tomorrow's Chiplet Solutions.

Comport Data

Canada

Comport Data offers analog, mixed-signal and digital IC design, layout, testing and manufacturing using CMOS, BiCMOS and Bipolar technologies and processes.

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