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Featured Vendors

Digicomm Semiconductor is a specialized engineering firm providing advanced end-to-end ASIC design, Packaging, and embedded software services.

Tessolve is the market leader in providing engineering solution for silicon and systems development. We offer a unique combination of both pre-silicon and post silicon expertise to provide an efficient turnkey solution for silicon bring up, spec to product.

Device Engineering is a Tempe, AZ, USA-based design and manufacturing facility specializing in Analog and Mixed-Signal Integrated Circuits.

A leading fabless ASIC / SoC design service and silicon IP provider with 20 years of experience.

Chipus (ISO 9001:2015 certified) provides full turnkey ASIC solutions, analog and mixed signal IP and design services in analog (design and layout) and digital domains (Modeling, RTL coding, verification and backend).

SGA

Sweden

SGA designs and manufactures mixed-signal, full-custom ASIC's for primarily industrial applications world-wide.

Chips&Media is a leading semiconductor HW IP provider specializing in multimedia IPs, video codecs, and deep learning-based upscaling super-resolution.

Established in 2003, KAL provides semiconductor deep tech consultancy and ASIC program management. KAL works with worldwide partners to deliver VLSI deep tech development, including digital, RF, and analog ASIC design services, supply chain services, IP cores, and libraries. We are capable of executing full spec to production projects and delivering fully tested ICs in high volume.

TSMC

Taiwan

Established in 1987, TSMC is the world's largest dedicated semiconductor foundry.

Know-how and lengthy experience is what makes us successful in the design of analog, digital and Mixed-Signal ASICs. Your partner for future-oriented, Cost-optimized ASIC solutions.

Creonic

Germany

Creonic is the leader in ready-for-use IP cores, offering a rich product portfolio for wired, wireless, fiber and free-space optical communications.

SkyWater Technology specializes in new technology process development and volume manufacturing ICs for mil/aero, consumer, medical, industrial and automotive markets.

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