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Breker RISC-V SystemVIP Deployed across 15 Commercial RISC-V Projects for Advanced Core and SoC Verification

SAN JOSE, CALIF. –– February 20, 2025 –– Breker Verification Systems today confirmed its RISC-V SystemVIP library components and test suite synthesis product portfolio is deployed in more than 15 commercial RISC-V semiconductor design projects, while its RISC-V products are used in several large-scale academic projects.
 
Large, complex application

Faraday Reports Full Year 2024 Results

Fourth Quarter 2024 Highlights [1]:

Revenue of NT$2,953 million (US$91.5 million)
Gross margin was 42.8%
Net income attributed to stockholders of the parent was NT$236 million (US$7.3 million)
Earnings per share of NT$0.91

【Hsinchu,  Taiwan】 Feb. 21, 2025
 
Faraday Technology Corporation (“Faraday” or the “Company”) (TWSE: 3035),

SignOff Semiconductors Unveils Expansion Plans with Its New Office in Penang, Malaysia

PENANG, Malaysia , Dec. 19, 2024  — SignOff Semiconductors Pvt. Ltd., headquartered in Bengaluru, India, and a leading provider of VLSI and Embedded Design services, is thrilled to announce the opening of its new office in Penang, Malaysia. This expansion enables the company to meet the growing demand for semiconductor chip design services from Fortune 500 companies operating in and expanding within Penang. It also aligns perfectly with the Malaysian government’s vision

YorChip announces Low latency 100G ULTRA Ethernet ready MAC/PCS IP for Edge AI

SAN RAMON, CA, UNITED STATES, February 19, 2025 — YorChip, Inc. in collaboration with its design partner SiliconIPs announces development of a 50nS latency 100G Ultra Ethernet ready Mac/PCS IP core. The IP is optimized for size, power and latency and targets edge AI applications as well as Data Center Accelerator

Arteris Revolutionizes Semiconductor Design with FlexGen – Smart Network-on-Chip IP

CAMPBELL, Calif., February 18, 2025 – Arteris, Inc. (Nasdaq: AIP), a leading provider of system IP which accelerates system-on-chip (SoC) creation, today introduced FlexGen, a revolutionary, smart network-on-chip (NoC) interconnect IP. FlexGen from Arteris dramatically accelerates chip development while optimizing performance efficiency, addressing the rising demand for faster, more sustainable innovation

ASE Expands its Chip Packaging and Testing Facility to Enable Next-Gen Applications

BAYAN LEPAS, Malaysia, February 18, 2025–ASE has officially launched its fifth plant in Penang, which will significantly build on the company’s strong packaging and testing capabilities in the Bayan Lepas Free Industrial Zone. The new plant is part of a strategic expansion plan that will expand the floor space of