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Brite Semiconductor Releases TCAM IP based on 28HKC+ Process

Shanghai, China — May 27, 2025 — Brite Semiconductor (Shanghai) Co., Ltd. (BriteSemi, 688691), a leading provider of custom ASIC and IP solutions, today announced the launch of Ternary Content-Addressable Memory (TCAM) IP developed on 28HKC+ 0.9V/1.8V platform. This IP has the features of high frequency and low power consumption. With the

Analogue Insight and Tetrivis Announce Joint Development of “Eurytion RFK1,” a UCIe based 12 nm Ka/Ku-Band RF Chiplet Transceiver

LONDON & BASINGSTOKE — 23 May 2025 — Analogue Insight Ltd. and Tetrivis Ltd. today unveiled a strategic collaboration to co-develop Eurytion RFK1, a 12 nm RF chiplet transceiver that delivers wide-band Ka/Ku operation with an integrated local oscillator and up to 2 GHz of instantaneous, fully-programmable bandwidth. Leveraging Tetrivis’

Wafer Testing: Ultimate Guide

What Is Wafer Testing?
 

 
Wafer testing—often called wafer sort or probe testing—is the process of electrically evaluating individual semiconductor dies directly on the wafer. Using precision probe needles to make contact with bond pads or dedicated test structures, wafer testing allows engineers to:
 

Verify Device

Wafer Probe: The Ultimate Guide

What Is Wafer Probe?
 

 
Wafer probe (or wafer probing) refers to the electrical testing of semiconductor dies while they are still part of the wafer. By using microscopic probe needles to contact bond pads or built-in test points on each die, engineers can:
 

Verify functionality:

Creonic Adds oFEC Codec IP Core to Portfolio, Expanding High-Speed Networking Solutions for ASIC and FPGA

Kaiserslautern, Germany – May 21, 2025 – Creonic GmbH, a leading provider of ready-to-use IP cores for ASIC and FPGA applications, announces the release of its new oFEC (Open Forward Error Correction) codec IP core. The solution supports next-generation optical and high-speed communication systems and is now available in both

Foxconn Invests €250M in Europe’s First Fan-Out Wafer Level Packaging Plant

Paris, France – May 19, 2025 – Foxconn Technology Group today unveiled a comprehensive €250 million investment plan in Europe, marking a strategic expansion into advanced semiconductor packaging, satellite manufacturing and electric vehicle production on the continent.
 
Key Highlights:

Joint Venture in Advanced Packaging: Foxconn will form