Blog

Intel Expands Foundry Ecosystem With TSMC, UMC, and Taiwanese IP Partners

Intel’s new CEO, Lip-Bu Tan, concluded his first earnings call, signaling a strong commitment to the company’s transformation. This transformation includes a strategic blend of internal manufacturing and external partnerships, notably with TSMC. Intel’s upcoming Nova Lake CPU will leverage both Intel’s own fabs and TSMC’s manufacturing capabilities, optimizing production

The Future of Semiconductors: A Deep Dive with Scott Bulbrook

This interview features Scott Bulbrook, President of DA-Integrated.
 

 
Can you describe your company’s founding vision and how it has evolved to address the changing landscape of the semiconductor industry?
 
DA-Integrated was founded to address a gap in the industry concerning the availability of test development services

New Audio Sample Rate Converter (ASRC) IP Core from CAST Offers Versatility with High Fidelity

Woodcliff Lake, New Jersey — April 29, 2025 — Semiconductor intellectual property core provider CAST today introduced a high-performance Audio Sample Rate Converter (ASRC) IP core that delivers real-time and batch-mode sample rate conversion with exceptional signal integrity, ultra-low distortion, and unmatched scalability. The company believes the new Audio Sample

UCIe™ — Universal Chiplet Interconnect Express

UCIe, is a pivotal player in modern chip design that places emphatic power on high-bandwidth data transfer, efficient heat management, and reduced leakage. This standard features bioinspired advancements, system co-optimization, and integration with cutting-edge 3D packaging, which together revolutionize AI, high-performance computing, and consumer electronics. Alongside optical I/O advancements, UCIe

Premier ASIC and SoC Design Partner Rebrands as Aion Silicon

READING, U.K. – April 28, 2025 – Aion Silicon (formerly Sondrel), a premier ASIC/SoC architecture and design partner, today officially unveiled its new name, vision, and leadership team. The company is leveraging decades of experience to deliver advanced System-on-Chip (SoC) solutions and tailored ASIC services that help customers navigate the complex challenges

Certus Semiconductor Joins TSMC IP Alliance Program to Enhance Custom I/O and ESD Solutions

Santa Clara, CA / April 23, 2025 – Certus Semiconductor, a leading provider of custom I/O and ESD Solutions to the semiconductor industry, is announcing an official partnership to join the TSMC Intellectual Property (IP) Alliance program, a key element of the TSMC Open Innovation Platform® (OIP).
 

Certus Semiconductor,