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Texas Instruments to Invest More Than $60 Billion to Strengthen U.S. Semiconductor Manufacturing

allas, TX — June 18, 2025 — Texas Instruments Incorporated (Nasdaq: TXN) today announced plans to invest more than $60 billion in building and expanding semiconductor manufacturing facilities in the United States—marking one of the largest investments in domestic chip production in American history.
 
The multiyear initiative will span

X-FAB Expands 180nm XH018 Process with New Isolation Class for Enhanced SPAD Integration

Tessenderlo, Belgium – Jun 19, 2025

X-FAB Silicon Foundries SE, the leading analog/mixed-signal and specialty foundry, has released a new isolation class within its 180nm XH018 semiconductor process. Designed to support more compact and efficient single-photon avalanche diode (SPAD) implementations, this new isolation class

CAST Launches Multi-Channel DMA IP Core Ideal for Streaming Applications

Woodcliff Lake, New Jersey — June 19, 2025 — Semiconductor intellectual property core provider CAST has introduced a new direct memory access (DMA) IP core that alleviates a system’s host CPU from the resource-intensive task of managing data transfers between system memory and multiple peripherals with streaming interfaces.
 
The

Cadence Accelerates SoC, 3D-IC and Chiplet Design for AI Data Centers, Automotive and Connectivity in Collaboration with Samsung Foundry

June 17,2025 — SAN JOSE, Calif.— Cadence (Nasdaq: CDNS) today announced an expansion of its collaboration with Samsung Foundry, including a new multi-year IP agreement to broaden Cadence® memory and interface IP solutions in Samsung Foundry’s SF4X, SF5A and SF2P advanced process nodes. Furthering their ongoing technology collaboration, the companies are leveraging

MIPS and Cyient Semiconductor collaborate to bring Custom RISC-V-based intelligent power solutions to AI Power Delivery, Industrial Robotics, and Automotive

San Jose, CA & Hyderabad, India- June 12, 2025: Cyient Semiconductors Private Limited, a fast-growing custom silicon company based in Hyderabad, and MIPS, a global leader in RISC-V processor IP, today announced a strategic collaboration to develop domain-optimized ASIC (application-specific integrated circuit) and ASSP (application-specific standard product) solutions that leverage

Imec presents 150 GSa/s Digital-to-Analog Converter (DAC) achieving 300 Gb/s data transmission

LEUVEN (Belgium), JUNE 11, 2025— This week at the 2025 Symposium on VLSI Technology and Circuits, imec, a world-leading research and innovation hub in nanoelectronics and digital technologies, and IDLab, an imec research group at Ghent University and the University of Antwerp, Belgium, announced a significant breakthrough in high-speed digital-to-analog conversion.