Category Archives: IP Cores

CEO Talk: Karel Masařík

This interview was held with Karel Masařík, Founder and Chief Executive Officer at Codasip, Ltd.
 

 
Tell me a bit about your background. How did you first get started with your company?
 
Codasip was born a decade ago out of my PhD work at the Technical University of Brno. I

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Open-Silicon and Credo Demonstrate Solutions for Deep Learning and Networking Applications at TSMC OIP and Symposium in Amsterdam

Open-Silicon, a system-optimized custom SoC solution provider and long-standing member of TSMC’s Value Chain Aggregator (VCA) and Design Center Alliance (DCA) programs, and Credo, a global innovation leader in Serializer-Deserializer (SerDes) technology, will participate in a joint demonstration at the TSMC 2018 Open Innovation Platform Ecosystem Forum and Technology Symposium in

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Inomize joins Arm Approved Design Partner program

Inomize, one of the global ASIC Design Services leader has joined the Arm Approved Design Partner program . The program provides users of the Arm® DesignStart™ initiative with a global list of audited design houses offering expert support during the development of SoC designs.
 
“Inomize is thrilled to join the Arm

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Silicon Creations’ SerDes Technology Helps Power Leading-Edge 8K TV

Silicon Creations, a leading supplier of high-performance analog and mixed-signal intellectual property (IP), announced today that its SerDes (Serializer/Deserializer) receive and transmit PMA (Physical Media Attachment) technology has been deployed in an SoC that powers a leading 8K (UHD) flat-panel television.
 
The SoC was designed by Socle, an IC ODM

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Sankalp Semiconductor announces release of its eDP receiver IP for Chip on Glass Applications

Sankalp Semiconductor a design service company offering comprehensive digital & mixed signal SoC solutions today at 55th DAC 2018 announced release of its Embedded DisplayPort (eDP) receiver IP. DisplayPort offers high bandwidth, lower pin count and low power solutions for high-resolution displays. The Chip on Glass (COG) technology enables area

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T2M to showcase cutting-edge Cellular and Low Power Wireless IoT technologies at MWC Shanghai 2018

T2M, the world’s largest independent global semiconductor IP technology provider today announced that they will be showcasing their latest Cellular and Low Power Wireless IoT technology IP at MWC Shanghai on 27, 28 and 29th June at the Shanghai New International Expo Centre.
 
Mobile World Congress Shanghai is the

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