Category Archives: IP Cores

Sofics’ clipping/scaling circuit enhances reliability of Near Field Communication (NFC) and other wireless interfaces

Sofics bvba (www.sofics.com), a leading semiconductor integrated circuit IP provider announced that its technology to protect wireless antenna pads is now published as a patent by the European Patent Office. The clipping/scaling circuit is used to protect the Near Field Communication (NFC) antenna pads in an ultra-low power Bluetooth chip

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CAST Expands Popular UDP/IP Networking Cores Line

Semiconductor intellectual property (IP) provider CAST, Inc. today announced two extensions to its line of UDP/IP cores for lean Internet Protocol networking: an increase up to 32 channels for its existing 10G and 40G UDP/IP Hardware Protocol Stacks, and the upcoming release of a faster, 100G version of these IP cores.
 
The

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Agile Analog secures $5M in funding to change the semiconductor industry

Agile Analog, a Cambridge analog IP company, announces it has closed its latest Pre-A funding round with Delin Ventures, firstminute Capital and MMC Ventures for $5M.

Founded in 2017, Agile Analog will use the funding to expand the existing engineering team in Cambridge and deliver analog IP products to

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Moortec Support Canaan-Creative’s Mass Production ASIC on TSMC’s 7nm Process

Moortec, the market leading PVT Monitoring IP specialists are proud to have helped Canaan-Creative achieve mass production on TSMC’s 7nm process of their ASIC by utilising Moortec’s complete In-Chip Monitoring Subsystem IP for Process, Voltage and Temperature Sensing in the design. Moortec themselves have now shipped 2000 wafers on TSMC’s

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OPENEDGES NoC (Network on Chip) Interconnect IP & DDR Controller licensed by ASICLAND

OPENEDGES Technology, Inc., the world’s leading supplier of Memory Subsystem IP including Network On-Chip (NoC) and DDR Controller today announced that ASICLAND has licensed OICTM NoC Interconnect IP and OMCTM DDR Controller IP for artificial intelligence, data center, automotive & other applications.
 
ASICLAND is a leading design services company who provides

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Moortec Provide Embedded Monitoring Solutions for Arm’s Neoverse N1 System Development Platform on TSMC 7nm Process Technology

Moortec today announced the delivery of its In-Chip Monitoring solution on TSMC 7nm FinFET process to the new Arm® Neoverse™ N1 System Development Platform (SDP). As market leaders, Moortec supported integration and utilization of its process, voltage, and temperature (PVT) sensing subsystem technology to the platform, enabling the next-generation cloud-to-edge

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