Woodcliff Lake, NJ — August 6, 2020 — Silicon intellectual property provider CAST, Inc. today announced a new version of its HDLC/SDLC IP core that helps avionics system developers achieve compliance with the DO-254 standard at the most stringent Design Assurance Level, DAL-A.
The new core variant was developed
In this first part of a 2-part blog series, we look at defining worst case conditions, focusing specifically on device power.
With great power, comes great responsibility…
With each new technology node especially FinFET, the dynamic conditions within a chip are changing and becoming more complex in terms of process
Phison, the market leader in NAND Flash controllers chips and IPs for SSD, PCIe, SD, eMMC, ONFi, UFS & USB Consumer, Embedded & Enterprise applications has signed an agreement with T2M-IP, the world’s largest independent global semiconductor IP provider, to act as a global representative and business development partner of
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This interview was held with Koen Verhaege, CEO of Sofics.
Tell me a bit about your background? How did you first get started with your company?
I graduated from the University of Leuven, Belgium, with a degree in microelectronics in 1990 and started my professional career at
Plymouth, UK, 10th June 2020
Moortec today announced an addition to its deeply embedded monitoring portfolio, the Distributed Thermal Sensor (DTS) on TSMC N5 process technology. Moortec’s highly granular DTS offers a 7x area reduction in comparison to some standard in-chip thermal sensor solutions, and also supports high accuracy
Secure-IC offers you the opportunity to get access to its line of State-of-the-art reports, redacted by its Security Experts, daily involved in Research, Development and Consulting activities, with real hands-on knowledge of the covered subjects. The reports contain thorough analysis and essential information that will help readers build up-to-date knowledge
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