Outsourced Semiconductor Assembly and Test, commonly referred to as OSAT, plays a vital role in the semiconductor industry. These companies specialize in assembling and testing semiconductor devices designed by Integrated Device Manufacturers (IDMs) and fabless companies. OSATs provide services that include packaging raw silicon into usable chips and conducting rigorous
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Dec-16-2024 — United Microelectronics Corporation (UMC) (TW:2303) today announced a significant breakthrough in the advanced packaging market, securing a major contract from Qualcomm Incorporated (NASDAQ:QCOM) for high-performance computing (HPC) applications. This win marks a pivotal moment, challenging the long-held dominance of Taiwan Semiconductor Manufacturing Company (TSMC) in this critical sector.
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Oct. 28, 2024– Amkor Technology, Inc. (Nasdaq: AMKR), a leading provider of semiconductor packaging and test services, today announced robust financial results for the third quarter ended September 30, 2024, exceeding expectations driven by strong demand for its Advanced System-in-Package (SiP) technology.
Key Highlights:
Record Revenue: Net sales
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Imagine a world where electronic devices are exponentially more powerful yet astonishingly compact. This is the promise of 2.5D packaging, an innovative approach to semiconductor design. It’s reshaping the landscape of computing, from smartphones to servers.
In the realm of electronics, understanding the building blocks is key.
Faraday Technology Corporation (TWSE: 3035), a leading ASIC design service and IP provider, and Kiwimoore, a global leader in AI networking full-stack interconnect products and solutions, announced today that their jointly developed 2.5D packaging platform has successfully entered the mass production stage. The one-stop advanced packaging platform and service developed
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What is QFP IC Package?
In semiconductor technology, packaging with compact size and high performance is in high demand. Among several discovered semiconductor packaging technologies, Quad Flat Package (QFP) has been vibrant in electronics packaging, as presented in Figure 1.
QFP package is a mature semiconductor packaging technology for