Category Archives: Packaging

Amkor Technology Reports Strong Q3 2024 Results, Driven by Advanced SiP Demand

amkor smart package

Oct. 28, 2024– Amkor Technology, Inc. (Nasdaq: AMKR), a leading provider of semiconductor packaging and test services, today announced robust financial results for the third quarter ended September 30, 2024, exceeding expectations driven by strong demand for its Advanced System-in-Package (SiP) technology.
 
Key Highlights:

Record Revenue: Net sales

Read More

2.5D Packaging: Ultimate Guide

chiplets interconnect

Imagine a world where electronic devices are exponentially more powerful yet astonishingly compact. This is the promise of 2.5D packaging, an innovative approach to semiconductor design. It’s reshaping the landscape of computing, from smartphones to servers.
 

 
In the realm of electronics, understanding the building blocks is key.

Read More

Faraday and Kiwimoore Succeed in 2.5D Packaging Project for Mass Production

news

Faraday Technology Corporation (TWSE: 3035), a leading ASIC design service and IP provider, and Kiwimoore, a global leader in AI networking full-stack interconnect products and solutions, announced today that their jointly developed 2.5D packaging platform has successfully entered the mass production stage. The one-stop advanced packaging platform and service developed

Read More

The Ultimate Guide to QFP Package

QFP Package

What is QFP IC Package?
In semiconductor technology, packaging with compact size and high performance is in high demand. Among several discovered semiconductor packaging technologies, Quad Flat Package (QFP) has been vibrant in electronics packaging, as presented in Figure 1.
 
QFP package is a mature semiconductor packaging technology for

Read More

Amkor and TSMC to Expand Partnership and Collaborate on Advanced Packaging in Arizona

TSMC

TEMPE, Ariz. & HSINCHU, Taiwan–(BUSINESS WIRE)–Oct. 3, 2024– Amkor Technology, Inc. (Nasdaq: AMKR) and TSMC (TWSE: 2330, NYSE: TSM) announced today that the two companies have signed a memorandum of understanding to collaborate and bring advanced packaging and test capabilities to Arizona, further expanding the region’s semiconductor ecosystem.
 
This press release features multimedia. View the full

Read More

SkyWater Names Bassel Haddad as Sr. Vice President and General Manager of Advanced Packaging

BLOOMINGTON, Minn. – September, 2024 – SkyWater Technology (NASDAQ: SKYT), the trusted technology realization partner, today announced the appointment of Bassel Haddad as senior vice president and general manager of advanced packaging. Reporting to President and COO John Sakamoto, Haddad will build and scale SkyWater’s advanced packaging business serving both the defense

Read More
Logo Image
Privacy Overview

This website uses cookies so that we can provide you with the best user experience possible. Cookie information is stored in your browser and performs functions such as recognising you when you return to our website and helping our team to understand which sections of the website you find most interesting and useful.