News Archive

ASML Posts Record €11.7 Billion Q3 Sales as AI Demand Outruns Capacity

chip

15th-Oct-2026 — ASML reported record third-quarter 2026 net sales of €11.7 billion as demand for advanced semiconductor manufacturing equipment continues to rise alongside investment in artificial intelligence infrastructure. The Dutch lithography equipment supplier also warned that the production capacity currently planned for 2027 and 2028 may not be sufficient to meet customer demand, with some

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Global 300mm Fab Equipment Spending to Reach $227 Billion in 2029 as Buildout Accelerates, SEMI Projects

market research

SEMICON West – SAN FRANCISCO — October 13, 2026 — Global 300mm front-end fab equipment spending is projected to reach $149 billion in 2026, up 31% year-over-year, SEMI reported today in its latest 300mm Fab Outlook. Investment is expected to continue growing at double-digit rates through 2029, reaching $227 billion.
 
The stronger investment trajectory is

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GlobalFoundries Selected to Operate Two New U.S. Fabs Under $21 Billion U.S.-Japan Initiative

Oct-15th-2026– GlobalFoundries has been selected as the technology provider and operator for two new semiconductor fabs planned at its Malta, New York manufacturing site under a U.S.-Japan initiative that could provide up to $21 billion in funding.
 
The program would significantly expand U.S. semiconductor manufacturing capacity while strengthening cooperation between the United States and

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ElectraIC Launches the NEXUS N1 Series: A New Family of NVIDIA Jetson-Based AI Mini Supercomputers

chip

ElectraIC proudly announces the launch of the NEXUS N1 Series, a new family of AI Mini Supercomputers designed to accelerate innovation in defense, aerospace, robotics, autonomous systems, machine vision, and advanced embedded computing applications.
 

Powered by NVIDIA® Jetson™ technology and engineered by ElectraIC, the NEXUS N1 Series delivers exceptional AI computing performance, extensive

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Faraday Powers Intelligent Sensing with New 14nm MIPI C/D Combo PHY IP

press release

Hsinchu,  Taiwan】 13 Oct, 2026: Faraday Technology Corporation (TWSE: 3035), a leading provider of ASIC design services and IP, today announced the availability of its silicon-proven MIPI C/D Combo PHY IP on UMC’s 14nm FinFET process. The IP delivers a cost-effective, high-speed connectivity solution for vision AI, machine vision, smart imaging, and other advanced SoC applications

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Tessolve Secures $75 Million From Vector Line Capital to Fund Semiconductor Acquisitions

press release


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Oct-12th-2026– Tessolve Semiconductor has raised $75 million from U.S.-based Vector Line Capital to support strategic acquisitions, expand

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