The U.S. government is making one of its largest moves yet to strengthen domestic quantum computing capabilities, announcing proposed CHIPS and Science Act incentives worth approximately $2.013 billion for nine companies across the quantum ecosystem.
The funding is aimed at accelerating the development of fault-tolerant, utility-scale quantum computers while also building domestic manufacturing capacity
May 18, 2026 – LEUVEN (Belgium) — Imec, a world-leading research and innovation hub in advanced semiconductor technologies, announced that IC-Link by imec, imec’s design and manufacturing service provider for ASIC and silicon photonics, has joined TSMC Open Innovation Platform® (OIP) 3DFabric® Alliance. As part of the TSMC OIP ecosystem, the 3DFabric Alliance enables 3D integrated circuit
May 21, 2026 – MALTA, N.Y., – GlobalFoundries (NASDAQ: GFS) (GF) today announced that it is investing in Playground Global’s Fund IV as a limited partner through GF Accelerate, formalizing GF’s expanding commitment to early-stage deep tech startups tackling the world’s hardest problems. This investment extends GF’s work with leading technology-focused venture platforms and
The semiconductor foundry industry continued to show solid momentum in the first quarter of 2026, with growth led by AI-related demand, advanced-node capacity, power management ICs, automotive, industrial applications and specialty technologies.
The broader semiconductor market also remained strong. According to the Semiconductor Industry Association, global semiconductor sales reached US$298.5 billion in Q1 2026,
The average 8-inch capacity utilization rate among the world’s top 10 foundries is projected to approach 90% in 2026, and remain above 80% through 1H27
Foundries are reallocating 8-inch and 12-inch mature-node capacity toward power-related processes to improve ASP and profitability, benefiting Chinese foundries through order spillover
TSMC’s planned reduction in 12-inch mature-node capacity
May 16, 2026 — BENGALURU, India — SignOff Semiconductors, a leading provider of semiconductor design, embedded intelligence, and Edge AI solutions, successfully participated in India Electronics Week (IEW) 2026 — one of India’s premier platforms for electronics R&D and product engineering innovation. At Booth H6, SignOff demonstrated a compelling range of next-generation technologies spanning