Worldwide spending on AI is forecast to total $2.59 trillion in 2026, a 47% increase year-over-year, according to Gartner, Inc. a business and technology insights company.
“Through the next several years, the need for capacity will make AI infrastructure, including AI-optimized IaaS, AI-optimized servers, AI network fabric, AI processing semiconductors and devices,
May 25, 2026 –
SYDNEY – BrainChip Holdings Ltd. (ASX: BRN, OTCQX: BRCHF, BCHPY), the first commercial producer of neuromorphic artificial intelligence technology, today announced that it has entered into an IP distribution license agreement with ASICLAND Co., Ltd. (“ASICLAND”), a semiconductor solutions provider.
Under the agreement, BrainChip has granted ASICLAND a non-exclusive, worldwide,
May 25, 2026 –
ASML will enable the establishment and ramp-up of Tata Electronics’ Dholera fab with its holistic suite of lithography tools and solutions
The partnership will accelerate training of local talent, lithography intensive skill development, as well as proactive supply chain resilience
Given the importance of lithography in chip manufacturing,
May 25, 2026 –
Weebit Nano has completed a Share Purchase Plan to existing shareholders, raising approx. $15 million
SPP brings total funds raised to approx. $102 million, inclusive of recently completed $87 million Placement to institutional investors
Funds will be used to accelerate scale-up and commercialisation of Weebit’s leading ReRAM technology,
The U.S. government is making one of its largest moves yet to strengthen domestic quantum computing capabilities, announcing proposed CHIPS and Science Act incentives worth approximately $2.013 billion for nine companies across the quantum ecosystem.
The funding is aimed at accelerating the development of fault-tolerant, utility-scale quantum computers while also building domestic manufacturing capacity
May 18, 2026 – LEUVEN (Belgium) — Imec, a world-leading research and innovation hub in advanced semiconductor technologies, announced that IC-Link by imec, imec’s design and manufacturing service provider for ASIC and silicon photonics, has joined TSMC Open Innovation Platform® (OIP) 3DFabric® Alliance. As part of the TSMC OIP ecosystem, the 3DFabric Alliance enables 3D integrated circuit