Integrated Circuit Packaging

The richest directory of Integrated Circuit Packaging worldwide. Find the Integrated Circuit Packaging Suppliers that matches your needs.

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Presto Engineering

France

Presto Engineering, provides ASIC design and outsourced operations for semiconductor and IoT device companies, helping its customers minimize overhead, reduce risk and accelerate time-to-market.

Services

ASIC Design , Testing and Packaging, Qualification and Failure Analysis, Supply Chain Management, IoT Operations Outsourcing Solutions, RF and Mixed-Signal Test, Front-end Tape-out, Mask and Wafer Procurement, Back-end Manufacturing and Test, GLOBALFOUNDRIES Channel Partner

IP Cores

RFID analog front-end

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Device Engineering Incorporated

USA

Device Engineering is a Tempe, AZ, USA-based design and manufacturing facility specializing in Analog and Mixed-Signal Integrated Circuits.

Services

Analog & Mixed Signal IC Design Services – Sample Capabilities, Design & Layout Tools, RF ASIC Design & Wireless Integrated Circuits, RF ASIC Design Tools, Analog Semi-Custom Arrays (700 Series), Analog Semi-Custom Arrays (Data Archive)

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IBM Canada Ltd

Canada

IBM in Bromont is a world leader in semiconductor packaging technology and now known for our next generation photonic solutions.

Services

Advanced packaging Services, Semiconductor test services, Mechanical, electrical and thermal modeling, Analytical services, reliability and failure analysis

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E.K.S.S Microelectronics

Israel

EKSS Microelectronics was established in 2002 and provides Complex IC Product and Test Engineering, Assembly,Supply Chain Services & Consultancy to the Fabless Semiconductor & IC Design House community.

Services

Test Engineering, Package Design / Selection, IC Reliability Tests Management, Supply Chain Management

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ASIC North

USA

asicNorth provides comprehensive VLSI design services to the semiconductor industry offering a wide range of innovative and well-managed technical solutions.

Services

ASIC Design, Analog / Mixed Signal ASIC Design, RF ASIC & IP Design, Turn-Key Design & Supply Chain Management, IP Development / Verification / Characterization

IP Cores

Pipeline ADC, SAR ADC, RFID Building Blocks, Voltage Regulator

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GEDEC

Italy

GEDEC (GEnova DEsign Center) is an independent electronic system and integrated circuit design house, mainly focused in advanced electronic and ICs microelectronics design.

Services

ICs Design Service, ICs Layout Design Service, Power Management Circuit Consulting and Development, Analog Layout Resource Rraining, Automatic Test Equipment Full Support

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Amkor Technology Inc.

USA

Turnkey provider of packaging design, assembly and test services. Global operations include 11M ft2 of volume production, development, sales & support.

Services

Semiconductor Packaging, Packaging Technology, Design Services, Test Services, Turnkey Services

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Integra Technologies

USA

Integra Technologies and its full-turnkey capabilities of die preparation, packaging, testing and characterization of Hi-Rel semiconductor components and related value-added services.

Services

Wafer Processing, IC Assembly, Test Services, Volume Production, Quick Turn Production, Engineering Services & Credentials

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iNPACK

Israel

Complete OSAT solution: Single Die, MCM, Packaging Design, Substrates and Miniaturized PCBs, 3D Packaging, Test Services, Full Turnkey.

Services

Substrate and Packaging Design, Advanced Packaging Assembly, Substrate Manufacturing, Packaging Services, Full Turn Key

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TES Electronic Solutions

Germany

TES is a leading German ASIC Design House and IP company and provides embedded software, hardware, RF and antenna design services.

Services

ASIC design and supply chain management, ASIC design services

IP Cores

Video and Graphics, Digital IP, Analog IP

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Microdul

Switzerland

Microdul AG (ISO9001/ISO13485). Miniaturized Microelectronic Modules, Ultra-Low-Power ASICs (nA, nW) and Thick-Film.

Services

ASIC development & supply, ASIC Industrialization, Modules, Thick-film

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QP Technologies

USA

QP Technologies provides wafer prep, prototype and small-volume IC packaging and assembly services. We specialize in delivering full turnkey solutions.

Services

IC Packaging, IC Assembly, Advanced Assembly, Substrate Design & Development, Wafer Preparation

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Sencio

The Netherlands

Sencio develops and produces functional plastic encapsulation solutions for MEMS and sensor systems for harsh environments like automotive motor oil applications.

Services

Packaging Solutions, Packaging Services, Prototyping, Volume manufacturing, Back end wafer processing , Component supply management , In-house Packaging Technologies

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Taiwan Technology Innovations

Taiwan

Taiwan Technology Innovations (TTI) provide quality and cost-effective outsourced semiconductor assembly and testing services to customer.

Services

Packaging Support List, Tests Services

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Advanced Silicon

Switzerland

Advanced Silicon is a fabless mixed-signal IC solution provider for High-Voltage, High-pin count, and ultra-low noise peripheral SOCs.

Services

ASIC Design, Embedded Algorithms Design, Wafer Testing, Packaging , Quality

IP Cores

High-Voltage IP Cores, Analog IP Cores , Digital IP Cores

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Caliber Interconnect Solutions

India

Caliber interconnect Solutions provides full turnkey solutions ,from design through PCB FAB, and local Assembly with the highest industry standards ,for Medical, Military, and Automotive.

Services

Full Turnkey Wafer and Final Test , IC Package and Substrate Design, HDI and ATE PCB Design

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GF Micro

UK

GF Micro provides turnkey ASIC design and supply solutions for a range of applications including Aerospace, Industrial and Consumer.

Services

Chip Design and Development, Device Implementation, Turnkey solutions, Speciality funding

IP Cores

12 bit SAR ADC, Digital temperature sensor

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ALTER Technology

UK

Alter Technology are an OSAT providing assembly/packaging test and qualification services in the semiconductor industry.

Services

Packaging & Assembly, Electrical Wafer Sort & Final Test, Qualification & Failure Analysis, Fast-turn IC Assembly & Prototyping, Long-term Storage – Thermal-Absorptive Gas-Barrier, Back-end Turnkey Solutions – OSAT Services

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IMEC

Belgium

Imec.IC-link is the semiconductor manufacturing division of imec. We help innovators, entrepreneurs and universities realize their ideas in silicon by providing low-cost prototyping, volume production and system integration of electronic assemblies.

More than 500 IC projects tape-out a year. Co-work with more than 300 companies and more than 700 universities.

Services

ASIC, SOC design, Foundry services, Turn key (supply chain management), Package and testing , TSMC’s official VCA (Value Chain Aggregator) , MPW and mini ASIC Services

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EnSilica

UK

EnSilica expertise in the design and supply of custom analogue, mixed signal and digital IC’s in the consumer, automotive, industrial and communications markets.

Services

SoC Design, Supply Chain Management, ASIC Services, FPGA Design

IP Cores

Processor IP, Digital and Analog IP

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