The richest directory of Integrated Circuit Packaging worldwide. Find the Integrated Circuit Packaging Suppliers that matches your needs.
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UK
Alter Technology are an OSAT providing assembly/packaging test and qualification services in the semiconductor industry.
Packaging & Assembly, Electrical Wafer Sort & Final Test, Qualification & Failure Analysis, Fast-turn IC Assembly & Prototyping, Long-term Storage – Thermal-Absorptive Gas-Barrier, Back-end Turnkey Solutions – OSAT Services
View vendor pageTaiwan
Taiwan Technology Innovations (TTI) provide quality and cost-effective outsourced semiconductor assembly and testing services to customer.
Packaging Support List, Tests Services
View vendor pageIsrael
Complete OSAT solution: Single Die, MCM, Packaging Design, Substrates and Miniaturized PCBs, 3D Packaging, Test Services, Full Turnkey.
Substrate and Packaging Design, Advanced Packaging Assembly, Substrate Manufacturing, Packaging Services, Full Turn Key
View vendor pageIndia
Caliber interconnect Solutions provides full turnkey solutions ,from design through PCB FAB, and local Assembly with the highest industry standards ,for Medical, Military, and Automotive.
Full Turnkey Wafer and Final Test , IC Package and Substrate Design, HDI and ATE PCB Design
View vendor pageSweden
SGA designs and manufactures mixed-signal, full-custom ASIC's for primarily industrial applications world-wide.
ASIC Design and Supply, Analog and mixed-signal circuits
View vendor pageIndia
Digicomm Semiconductor is a specialized engineering firm providing advanced end-to-end ASIC design, Packaging, and embedded software services.
RTL Design and Verification, Design Verification, Design For Test, Physical Design, Static Timing Analysis, Post Silicon Validation
View vendor pageRepublic of Korea
Asicland provides ASIC turnkey services as a TSMC VCA partner. Backed by 400+ tape-out records, we help customers accelerate reliable silicon projects, including tape-out support for design-complete projects.
GDS Hand-off Wafer Production, Spec-in services, Front-end & Back-end Design, Foundry Manufacturing, Packaging, Test & Reliability
View vendor pageMalaysia
Key ASIC offers turnkey ASIC/SoC design services, specializing in AI, IoT, and medical applications with a focus on PPA optimization.
Design Service, Foundry Access, Testing and Packaging, Turnkey Solution
Interface IPs, Analog IPs, Fundamental IPs, Processor
View vendor pageThe Netherlands
ASIC supply chain partner with competitive solutions for IC manufacturing, packaging and test, lower volumes are welcome too.
Foundry services and foundry adapted IP solutions, Packaging services, Test solutions, Supply Chain
View vendor pageIC Design Services, Data converters, Power & Power management, High performance analog, Digital control, Lab validation
SARADC – 37.5 MS/s 12 bit SAR ADC, SARADC – 2MS/s 14 bit SAR ADC w/o Calibration, LLSDADC – High Resolution Low Latency ΣΔ ADC, SDCRDAC – 24 bit Sigma-Delta DAC, CRDAC – 12 bit charge-redistribution DAC, FIRDAC – High Accuracy Low OOBN ΣΔ DAC
View vendor pageIndia
SmartSoC Solutions, a global company providing turnkey solutions for ASIC/SOC and Chip to Product, Digital Design (RTL, Verification, DFT, PD, Emulation, Validation) and Analog Mixed signal IP design (Circuit design and Mask Design).
RTL Design, RTL Design Verification, DFT, Netlist to GDS, Analog Circuit and Layout, Post Silicon Services
View vendor pageUSA
Application-Specific Integrated Circuit (ASIC) design services, IP and turnkey solutions since 2006. Our ASICs include analog, mixed-signal and digital functionality.
Digital Frontend and Backend from Spec to Silicon, From Wish-list/Spec to Silicon, From wish-list to ASIC Part or PCB Level Solution, Augmenting Customer Team with Specific Expertise, Custom PCB Design, Post Silicon Services, Analog IP, Data Converters (ADC/DAC), Interfaces
View vendor pageIsrael
EKSS Microelectronics was established in 2002 and provides Complex IC Product and Test Engineering, Assembly,Supply Chain Services & Consultancy to the Fabless Semiconductor & IC Design House community.
Test Engineering, Package Design / Selection, IC Reliability Tests Management, Supply Chain Management
View vendor pageGermany
TES is a leading German ASIC Design House and IP company and provides embedded software, hardware, RF and antenna design services.
ASIC design and supply chain management, ASIC design services
Video and Graphics, Digital IP, Analog IP
View vendor pageUK
EnSilica expertise in the design and supply of custom analogue, mixed signal and digital IC’s in the consumer, automotive, industrial and communications markets.
SoC Design, Supply Chain Management, ASIC Services, FPGA Design
Processor IP, Digital and Analog IP
View vendor pageJapan
We deliver industrial ASIC turnkey solutions from specification to mass production, leveraging over 10 foundries including the world's largest.
ASIC Turnkey Service / ASIC Prototyping Service, IC Design Services, Power Semiconductor Turnkey Service
View vendor pageFrance
Presto Engineering, provides ASIC design and outsourced operations for semiconductor and IoT device companies, helping its customers minimize overhead, reduce risk and accelerate time-to-market.
ASIC Design , Testing and Packaging, Qualification and Failure Analysis, Supply Chain Management, IoT Operations Outsourcing Solutions, RF and Mixed-Signal Test, Front-end Tape-out, Mask and Wafer Procurement, Back-end Manufacturing and Test, GLOBALFOUNDRIES Channel Partner
RFID analog front-end
View vendor pageUK
Swindon is a leader in the design, production test and supply of industrial and automotive mixed signal ASICs (Custom ICs).
Custom IC Solutions, Design and Supply of Industrial ASICs , Design and Supply of Automotive ASICs
View vendor pageCanada
CMC helps researchers and industrial users develop innovations in microsystems and nanotechnologies.
Fabrication Services, CAD Services, R&D Services
View vendor pageUSA
Micross… The Most Complete Provider of Hi-Rel Microelectronics, Die & Wafer, and Semiconductor Services.
Test and Qualification, OSAT, Component Modification, Supply Chain Services, Advanced Packaging, Wafer Processing
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