The richest directory of Integrated Circuit Packaging worldwide. Find the Integrated Circuit Packaging Suppliers that matches your needs.
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France
Presto Engineering, provides ASIC design and outsourced operations for semiconductor and IoT device companies, helping its customers minimize overhead, reduce risk and accelerate time-to-market.
ASIC Design , Testing and Packaging, Qualification and Failure Analysis, Supply Chain Management, IoT Operations Outsourcing Solutions, RF and Mixed-Signal Test, Front-end Tape-out, Mask and Wafer Procurement, Back-end Manufacturing and Test, GLOBALFOUNDRIES Channel Partner
RFID analog front-end
View vendor pageUSA
Device Engineering is a Tempe, AZ, USA-based design and manufacturing facility specializing in Analog and Mixed-Signal Integrated Circuits.
Analog & Mixed Signal IC Design Services – Sample Capabilities, Design & Layout Tools, RF ASIC Design & Wireless Integrated Circuits, RF ASIC Design Tools, Analog Semi-Custom Arrays (700 Series), Analog Semi-Custom Arrays (Data Archive)
View vendor pageCanada
IBM in Bromont is a world leader in semiconductor packaging technology and now known for our next generation photonic solutions.
Advanced packaging Services, Semiconductor test services, Mechanical, electrical and thermal modeling, Analytical services, reliability and failure analysis
View vendor pageIsrael
EKSS Microelectronics was established in 2002 and provides Complex IC Product and Test Engineering, Assembly,Supply Chain Services & Consultancy to the Fabless Semiconductor & IC Design House community.
Test Engineering, Package Design / Selection, IC Reliability Tests Management, Supply Chain Management
View vendor pageUSA
asicNorth provides comprehensive VLSI design services to the semiconductor industry offering a wide range of innovative and well-managed technical solutions.
ASIC Design, Analog / Mixed Signal ASIC Design, RF ASIC & IP Design, Turn-Key Design & Supply Chain Management, IP Development / Verification / Characterization
Pipeline ADC, SAR ADC, RFID Building Blocks, Voltage Regulator
View vendor pageItaly
GEDEC (GEnova DEsign Center) is an independent electronic system and integrated circuit design house, mainly focused in advanced electronic and ICs microelectronics design.
ICs Design Service, ICs Layout Design Service, Power Management Circuit Consulting and Development, Analog Layout Resource Rraining, Automatic Test Equipment Full Support
View vendor pageUSA
Turnkey provider of packaging design, assembly and test services. Global operations include 11M ft2 of volume production, development, sales & support.
Semiconductor Packaging, Packaging Technology, Design Services, Test Services, Turnkey Services
View vendor pageUSA
Integra Technologies and its full-turnkey capabilities of die preparation, packaging, testing and characterization of Hi-Rel semiconductor components and related value-added services.
Wafer Processing, IC Assembly, Test Services, Volume Production, Quick Turn Production, Engineering Services & Credentials
View vendor pageIsrael
Complete OSAT solution: Single Die, MCM, Packaging Design, Substrates and Miniaturized PCBs, 3D Packaging, Test Services, Full Turnkey.
Substrate and Packaging Design, Advanced Packaging Assembly, Substrate Manufacturing, Packaging Services, Full Turn Key
View vendor pageGermany
TES is a leading German ASIC Design House and IP company and provides embedded software, hardware, RF and antenna design services.
ASIC design and supply chain management, ASIC design services
Video and Graphics, Digital IP, Analog IP
View vendor pageSwitzerland
Microdul AG (ISO9001/ISO13485). Miniaturized Microelectronic Modules, Ultra-Low-Power ASICs (nA, nW) and Thick-Film.
ASIC development & supply, ASIC Industrialization, Modules, Thick-film
View vendor pageUSA
QP Technologies provides wafer prep, prototype and small-volume IC packaging and assembly services. We specialize in delivering full turnkey solutions.
IC Packaging, IC Assembly, Advanced Assembly, Substrate Design & Development, Wafer Preparation
View vendor pageThe Netherlands
Sencio develops and produces functional plastic encapsulation solutions for MEMS and sensor systems for harsh environments like automotive motor oil applications.
Packaging Solutions, Packaging Services, Prototyping, Volume manufacturing, Back end wafer processing , Component supply management , In-house Packaging Technologies
View vendor pageTaiwan
Taiwan Technology Innovations (TTI) provide quality and cost-effective outsourced semiconductor assembly and testing services to customer.
Packaging Support List, Tests Services
View vendor pageSwitzerland
Advanced Silicon is a fabless mixed-signal IC solution provider for High-Voltage, High-pin count, and ultra-low noise peripheral SOCs.
ASIC Design, Embedded Algorithms Design, Wafer Testing, Packaging , Quality
High-Voltage IP Cores, Analog IP Cores , Digital IP Cores
View vendor pageIndia
Caliber interconnect Solutions provides full turnkey solutions ,from design through PCB FAB, and local Assembly with the highest industry standards ,for Medical, Military, and Automotive.
Full Turnkey Wafer and Final Test , IC Package and Substrate Design, HDI and ATE PCB Design
View vendor pageUK
GF Micro provides turnkey ASIC design and supply solutions for a range of applications including Aerospace, Industrial and Consumer.
Chip Design and Development, Device Implementation, Turnkey solutions, Speciality funding
12 bit SAR ADC, Digital temperature sensor
View vendor pageUK
Alter Technology are an OSAT providing assembly/packaging test and qualification services in the semiconductor industry.
Packaging & Assembly, Electrical Wafer Sort & Final Test, Qualification & Failure Analysis, Fast-turn IC Assembly & Prototyping, Long-term Storage – Thermal-Absorptive Gas-Barrier, Back-end Turnkey Solutions – OSAT Services
View vendor pageBelgium
Imec.IC-link is the semiconductor manufacturing division of imec. We help innovators, entrepreneurs and universities realize their ideas in silicon by providing low-cost prototyping, volume production and system integration of electronic assemblies.
More than 500 IC projects tape-out a year. Co-work with more than 300 companies and more than 700 universities.
ASIC, SOC design, Foundry services, Turn key (supply chain management), Package and testing , TSMC’s official VCA (Value Chain Aggregator) , MPW and mini ASIC Services
View vendor pageUK
EnSilica expertise in the design and supply of custom analogue, mixed signal and digital IC’s in the consumer, automotive, industrial and communications markets.
SoC Design, Supply Chain Management, ASIC Services, FPGA Design
Processor IP, Digital and Analog IP
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