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Israel
Beckermus Technologies (founded in 1998) provides full assembly and packaging services for Microelectronics, Micro Optics and Photonics.
Microelectronic Assembly Services, ectro-Optics and Photonics Assembly Services , Electro Optical Design , Supply Chain Services , Wafer Level Services
View vendor pageChina
Peilun is a worldwide ASIC design service provider, business model including ASIC turnkey solution, or FPGA to ASIC, or IP/customization.
SoC Turnkey Service, IP or chip customization, SOC design platform
View vendor pageUSA
MosChip provides turnkey analog, digital and mixed-signal ASIC design, IP design, embedded solutions, product and systems engineering for connectivity, computing, storage, networking, consumer and industrial SoCs. Over the past 2 decades, MosChip has developed and shipped millions of connectivity ICs.
Turnkey ASIC – Full-Cycle Silicon Development, RTL Design & Verification, Analog Mixed-Signal Design and Layout, Synthesis, DFT & Physical Design, Post-Silicon Validation, IP Services, Product Engineering Services
View vendor pageFrance
Teledyne e2v offers a range of semiconductor services, including high-reliability assembly and test, high-performance package design and long-term support.
We are specialist of flip-chip assembly for the space market, including very large dies. We offer hermetic ceramic assembly or organic.
Our plant is QML-V and QML-Y certified.
Our Capabilities, Flip-chip capabilities, Dealing with larger scale dies, COTS and custom solutions to meet the toughest expectations, Upholding the highest quality standards, System in package
View vendor pageUSA
Rochester provides a range of manufacturing services, such as wafer storage, die processing, design, assembly, electrical testing, failure analysis, and reliability testing.
Wafer Storage & Processing, Assembly Services, Electrical Test Services, Analytical Services, Reliability Testing
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