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EnSilica

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Isine

iSine

USA

iSine was founded in 1981 to provide ASIC design, development and manufacturing solutions. Patented LED ballast chips are in production.

Services

Fabless Semicoductor Supplier, Design Services – Analog & Digital ASIC design, Design Services – FPGAs, Design Services – IC Lifecycle Management – EOL Redesign

IP Cores

Analog IP Cores, Digital IP Cores

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TTI Company

Taiwan Technology Innovations

Taiwan

Taiwan Technology Innovations (TTI) provide quality and cost-effective outsourced semiconductor assembly and testing services to customer.

Services

Packaging Support List, Tests Services

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Teledyne e2v Semiconductors

Teledyne e2v Semiconductors

France

Teledyne e2v offers a range of semiconductor services, including high-reliability assembly and test, high-performance package design and long-term support.
We are specialist of flip-chip assembly for the space market, including very large dies. We offer hermetic ceramic assembly or organic.
Our plant is QML-V and QML-Y certified.

Services

Our Capabilities, Flip-chip capabilities, Dealing with larger scale dies, COTS and custom solutions to meet the toughest expectations, Upholding the highest quality standards, System in package

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GEDEC

Italy

GEDEC (GEnova DEsign Center) is an independent electronic system and integrated circuit design house, mainly focused in advanced electronic and ICs microelectronics design.

Services

ICs Design Service, ICs Layout Design Service, Power Management Circuit Consulting and Development, Analog Layout Resource Rraining, Automatic Test Equipment Full Support

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racyics

Racyics

Germany

Racyics is an experienced integrated circuit design service provider and GLOBALFOUNDRIES channel partner with focus on advanced semiconductor nodes.

Services

Design Services, Foundry Access, Custom IP, Turnkey Solution, makeChip Hosted Design Service Platform

IP Cores

0.4V Standard Cell Library for 22FDX (22nm FDSOI), Adaptive Body Bias Solution for 22FDX (22nm FDSOI)

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