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Advanced packaging Services, Semiconductor test services, Mechanical, electrical and thermal modeling, Analytical services, reliability and failure analysis
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IC and Board Level Reliability, Failure Analysis & Eng Samples Preparation, FIB Circuit Edits Down to 3nm Process and Wafer Surface , Analog Design, ASIC Design and Supply Chain
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Logic Design (Front-End), ASIC Design RTL to GDS2, Analog & RF Design, Productization, Production, Additional Services
CPU & SoC, Security, General Purpose IP, Analog IP
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Implementation Feasibility, ASIC Concept, ASIC Design, ASIC Manufacturing, Assembly and Test, ASIC Qualification and Failure Analysis, ASIC Logistics
IP Library
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Design Verification, Physical Design , Design for Test (DFT) , Analog & Mixed Signal (AMS) Design, Embedded & Product Engineering Services
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