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Chip Design and Development, Device Implementation, Turnkey solutions, Speciality funding
12 bit SAR ADC, Digital temperature sensor
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Semiconductor Packaging, Packaging Technology, Design Services, Test Services, Turnkey Services
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PHYSICAL LAYOUT, VERIFICATION, MODELING, PDK DEVELOPMENT, LIBRARY (LAYOUT/ CHAR), EMBEDDED SERVICES
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IC and Board Level Reliability, Failure Analysis & Eng Samples Preparation, FIB Circuit Edits Down to 3nm Process and Wafer Surface , Analog Design, ASIC Design and Supply Chain
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Turnkey ASIC Design , Post Fabrication – Packaging & Testing, Consultation Services, Custom ROIC & ASIC Design
Column ADC Patent, Extensive IP Library
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