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USA
Green Mountain Semiconductor provides full custom circuit design and layout services, from individual expert contracting to turn-key product development.
AI Circuit Design, Analog & Mixed Signal Design, Emerging Memory Development, Special Purpose Applications, Interface Solutions
View vendor pageFrance
Presto Engineering, provides ASIC design and outsourced operations for semiconductor and IoT device companies, helping its customers minimize overhead, reduce risk and accelerate time-to-market.
ASIC Design , Testing and Packaging, Qualification and Failure Analysis, Supply Chain Management, IoT Operations Outsourcing Solutions, RF and Mixed-Signal Test, Front-end Tape-out, Mask and Wafer Procurement, Back-end Manufacturing and Test, GLOBALFOUNDRIES Channel Partner
RFID analog front-end
View vendor pageFrance
Teledyne e2v offers a range of semiconductor services, including high-reliability assembly and test, high-performance package design and long-term support.
We are specialist of flip-chip assembly for the space market, including very large dies. We offer hermetic ceramic assembly or organic.
Our plant is QML-V and QML-Y certified.
Our Capabilities, Flip-chip capabilities, Dealing with larger scale dies, COTS and custom solutions to meet the toughest expectations, Upholding the highest quality standards, System in package
View vendor pageGermany
TES is a leading German ASIC Design House and IP company and provides embedded software, hardware, RF and antenna design services.
ASIC design and supply chain management, ASIC design services
Video and Graphics, Digital IP, Analog IP
View vendor pageUSA
Mirafra is a global Engineering Services company with expertise in Semiconductor Design & Verification, Embedded and Application Software services.
Design Verification, Design Implementation (RTL to GDSII), RTL Design, Design for Test (DFT), Analog & Mixed Signal Design, Emulation and Post Silicon Validation
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