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Package Design Services, Package Assembly Services, High Temperature Design and Package Assembly, Electrical Test and Device Characterization, Wafer Probe, Device Qualification
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RTL Design, Verification, Analog Layout, Physical Design, System Engineering, Embedded Software/Firmware
Custom SerDes, ARM HSSTP PHY with Link Layer, PCIe PHY, XAUI PHY, CEI SR PHY, SATA PHY
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Advanced Logic - 40nm, 65/55nm, Mature Logic - 90nm, 0.13um/0.11um, Mature Technology 0.18μm, 0.35μm, Non-Volatile Memory, Analog/Power, Turnkey Services
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Full turnkey ASIC, IC design services, Analog and mixed signal IP, Supply Chain Management, Team augmentation
Power Management, Data Converters, Clock Management, Sensors , Front Ends
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