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Our Capabilities, Flip-chip capabilities, Dealing with larger scale dies, COTS and custom solutions to meet the toughest expectations, Upholding the highest quality standards, System in package
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RTL Design, Verification, Analog Layout, Physical Design, System Engineering, Embedded Software/Firmware
Custom SerDes, ARM HSSTP PHY with Link Layer, PCIe PHY, XAUI PHY, CEI SR PHY, SATA PHY
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Analog and Mixed-Signal Circuits, Digital Systems and Data Processing, Wireline Communications, Radio Frequency Integrated Circuits, ASIC Foundry Services, Integrated Sensor Systems
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Package Design Services, Package Assembly Services, High Temperature Design and Package Assembly, Electrical Test and Device Characterization, Wafer Probe, Device Qualification
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