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IC Packaging, IC Assembly, Advanced Assembly, Substrate Design & Development, Wafer Preparation
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PIC Design Service, PIC Consultancy Service, PIC Testing Service (Die and Wafer level), PIC Packaging Service, PIC Manufacturing Service, PIC Training Service
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Chip Design and Development, Device Implementation, Turnkey solutions, Speciality funding
12 bit SAR ADC, Digital temperature sensor
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IC Design Services, Semiconductor IP & Chip products, Full cycle ASIC and SoC Turnkey Solution , ASIC characterization services, Partner Access
CoreVCO, CorePLL, CorePLL6G, CoreADC, CoreDCDC, Antenna switch, Antennas, CoreHW IPs
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Turnkey ASIC Design , Post Fabrication – Packaging & Testing, Consultation Services, Custom ROIC & ASIC Design
Column ADC Patent, Extensive IP Library
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