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Wafer Processing, Test Services, COB/COF/MCM, SMT & Module Assembly, IC Packaging
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Advanced packaging Services, Semiconductor test services, Mechanical, electrical and thermal modeling, Analytical services, reliability and failure analysis
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IC Design Services, Semiconductor IP & Chip products, Full cycle ASIC and SoC Turnkey Solution , ASIC characterization services, Partner Access
CoreVCO, CorePLL, CorePLL6G, CoreADC, CoreDCDC, Antenna switch, Antennas, CoreHW IPs
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Development and Process Engineering, High Standard of Technological Equipment, Wafer Back-End Services
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Test Engineering, Package Design / Selection, IC Reliability Tests Management, Supply Chain Management
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