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Substrate and Packaging Design, Advanced Packaging Assembly, Substrate Manufacturing, Packaging Services, Full Turn Key
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Turnkey ASIC Design, IP Blocks Design, Radioelectronic Devices Development
RF Transceivers, PLL, ADC, Process, Voltage and Temperature Sensors (PVT sensor/detector/controller), RFID (UHF tag, ID card, NFC, medical implants), Energy harvesting (power converters from RF-field to voltage and current)
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GDS Hand-off Wafer Production, Spec-in services, Front-end & Back-end Design, Foundry Manufacturing, Packaging, Test & Reliability
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PIC Design Service, PIC Consultancy Service, PIC Testing Service (Die and Wafer level), PIC Packaging Service, PIC Manufacturing Service, PIC Training Service
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Digital Frontend and Backend from Spec to Silicon, From Wish-list/Spec to Silicon, From wish-list to ASIC Part or PCB Level Solution, Augmenting Customer Team with Specific Expertise, Custom PCB Design, Post Silicon Services, Analog IP, Data Converters (ADC/DAC), Interfaces
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