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Spec2parts, FPGA Prototyping & Validation, Derivative Chips, Automotive Chips, Chiplets, IP Hardening
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SystematIC- Custom ASIC Design, Turnkey (Supply chain Services), Sensor Interfacing, Integrated Power, High Voltage Expertise
Analog IP
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Package Design Services, Package Assembly Services, High Temperature Design and Package Assembly, Electrical Test and Device Characterization, Wafer Probe, Device Qualification
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Fabless Semicoductor Supplier, Design Services – Analog & Digital ASIC design, Design Services – FPGAs, Design Services – IC Lifecycle Management – EOL Redesign
Analog IP Cores, Digital IP Cores
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Our Capabilities, Flip-chip capabilities, Dealing with larger scale dies, COTS and custom solutions to meet the toughest expectations, Upholding the highest quality standards, System in package
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