Movellus Inc. provides the lowest power and lowest area PLLs, DLLs, and ADCs in the industry. Customizable in weeks!
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Packaging foundry aiming to become world leader in the assembly of photonic ICs in scalable volumes.
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Tessolve is the market leader in providing engineering solution for silicon and systems development. We offer a unique combination of both pre-silicon and post silicon expertise to provide an efficient turnkey solution for silicon bring up, spec to product.
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ASIC design service and silicon IP provider specializing in analog/mixed-signal and RF design (GNSS, RFID, telecom, medical, sensors).
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As one of the leading independent fabless IC-Design institutions in Europe, Fraunhofer IIS offers turnkey solutions for customized mixed-signal ASICs and integrated sensor systems with over 30 years of experience.
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High-performance, ultra-low power IP in advanced nodes for 5G, wireline/optical communications, LiDAR, Radar, automotive networking, AI, image sensors, and IoT.
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